Patent Assignment
Reel/Frame 011955/0209
Assignment of Assignor's Interest
Recorded: 2001-06-27
Received: 2001-07-12
Pages: 3
Assignee
ADVANCED MICRO DEVICES, INC.
P.O. BOX 3453, ONE AMD PLACE, SUNNYVALE, CA, 94088, UNITED STATES
Covered Property
(1)
Integrated Circuit Manufacturing Method Including Seed Layer Deposition, Removal, and Subsequent Deposition
Application:
09/894,525 →