IP Library › Granted Patent US 6,455,413
Granted Patent Utility
US 6,455,413 · Confirmation No. 6000

INTEGRATED CIRCUIT MANUFACTURING METHOD INCLUDING SEED LAYER DEPOSITION, REMOVAL, AND SUBSEQUENT DEPOSITION

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2020-02-27 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2020-02-27 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2020-02-25 PA.. Power of Attorney 1 View
2020-02-25 R3.73 Assignee showing of ownership per 37 CFR 3.73 7 View
2020-02-25 N417 Electronic Filing System Acknowledgment Receipt 2 View
2001-06-27 TRNA Transmittal of New Application 2 View
2001-06-27 ADS Application Data Sheet 1 View
2001-06-27 SPEC Specification 8 View
2001-06-27 CLM Claims 3 View
2001-06-27 ABST Abstract 1 View
2001-06-27 DRW Drawings-only black and white line drawings 3 View
2001-06-27 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,455,413
App. No.
09/894,525
Filed
2001-06-27
Granted
2002-09-24
Art Unit
2813
PTA
-1 days