Patent Assignment
Reel/Frame 011963/0509
Assignment of Assignor's Interest
Recorded: 2001-07-02
Pages: 2
Assignors
KANEDA, YUTAKA
Executed: 2001-06-19
NAITO, KEIICHI
Executed: 2001-06-19
KISHIMOTO, SOICHIRO
Executed: 2001-06-21
SHINOHARA, TOSHIHIRO
Executed: 2001-06-20
Assignee
SONY CHEMICALS CORP.
CHUO-KU, 6-3, NIHONBASHI-MUROMACHI 1-CHOME, TOKYO 103-0022, JAPAN
Covered Property
(1)
Bump-Attached Wiring Circuit Board and Method for Manufacturing Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.