IP Library › Assignment 029445/0268
Patent Assignment
Reel/Frame 029445/0268

Assignment of Assignor's Interest

Recorded: 2012-12-11 Pages: 5
Assignor
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Properties (39)
Recording Medium for Thermal Transfer Recording
Patent: 5,556,701 →
Application: 08/365,573 →
Short-Distance Communication Antenna and Methods of Manufacturing and Using the Short-Distance Communication Antenna
Patent: 5,694,139 →
Application: 08/493,818 →
Multiple Loop Antenna
Patent: 5,764,196 →
Application: 08/635,379 →
Antenna for Reader/Writer
Patent: 6,137,447 →
Application: 08/721,949 →
Heat Transfer Ink Ribbon
Patent: 6,099,967 →
Application: 09/065,105 →
Circuit Board and Production Method Thereof
Patent: 6,323,434 →
Application: 09/194,161 →
Thermal Transfer Recording Medium and Processes for Preparing Them
Patent: 6,174,607 →
Application: 09/403,499 →
Method of Manufacturing a Flexible Circuit Board
Patent: 6,344,308 →
Application: 09/440,167 →
Method for Manufacturing Double-Sided Flexible Printed Board
Patent: 6,705,007 →
Application: 09/459,895 →
Processes for manufacturing flexible printed wiring boards
Patent: 6,294,316 →
Application: 09/477,815 →
Elemental Piece of Flexible Printed Wiring Board and Flexible Printed Wiring Board
Patent: 6,717,064 →
Application: 09/494,040 →
Flexible Board Made by Joining Two Pieces Through an Adhesive Film
Patent: 6,437,251 →
Application: 09/505,871 →
Flexible Wiring Board Pieces and Wiring Sheets
Patent: 6,420,659 →
Application: 09/610,308 →
Multi-Layer Flexible Printed Wiring Board
Patent: 6,404,052 →
Application: 09/610,674 →
Processes for Manufacturing Flexible Wiring Boards and the Resulting Flexible Wiring Board
Patent: 6,737,588 →
Application: 09/640,862 →
Multilayer Flexible Wiring Boards Including Malleable Resin Layer Manufactured with the Use of Ultrasonic Wave
Patent: 6,583,364 →
Application: 09/642,638 →
Multilayer Flexible Wiring Boards
Patent: 6,395,993 →
Application: 09/671,260 →
Multilayer Flexible Wiring Boards and Processes for Manufacturing Multilayer Flexible Wiring Boards
Patent: 6,812,060 →
Application: 09/688,181 →
Method for Manufacturing Wiring Circuit Boards with Bumps and Method for Forming Bumps
Patent: 6,562,250 →
Application: 09/697,453 →
Method of Fabricating Multilayer Flexible Wiring Boards
Patent: 6,524,892 →
Application: 09/707,957 →
Processes for Manufacturing Flexible Wiring Boards
Patent: 6,643,923 →
Application: 09/744,572 →
Printed Wiring Board and Method for Producing the Same
Patent: 6,570,098 →
Application: 09/793,978 →
Publication: US 2001/0040794
Bump-Attached Wiring Circuit Board and Method for Manufacturing Same
Patent: 6,518,510 →
Application: 09/895,210 →
Publication: US 2002/0005292
Flexible Printed Wiring Boards
Patent: 6,930,390 →
Application: 09/909,827 →
Publication: US 2001/0050434
Process for Producing a Fexible Wiring Board
Patent: 6,718,631 →
Application: 09/912,492 →
Publication: US 2002/0011348
Heat-Resistant Film and Thermal Transfer Recording Medium
Patent: 6,808,770 →
Application: 10/054,730 →
Publication: US 2002/0150735
Processes for Manufacturing Flexible Wiring Boards and the Resulting Flexible Wiring Boards
Patent: 6,729,022 →
Application: 10/230,329 →
Publication: US 2002/0189857
Multilayer Flexible Wiring Boards
Patent: 6,653,736 →
Application: 10/323,915 →
Publication: US 2003/0089984
Ultrasonic Manufacturing Apparatus
Patent: 6,926,187 →
Application: 10/423,977 →
Publication: US 2003/0234085
Process for Manufacturing Multilayer Flexible Wiring Boards
Patent: 6,991,148 →
Application: 10/423,978 →
Publication: US 2005/0028358
Thermal Transfer Recording Medium and Photographic Print
Patent: 7,128,955 →
Application: 10/506,581 →
Publication: US 2005/0163946
Perfluoropolyether Ester Compound, Lubricant and Magnetic Recording Medium
Patent: 7,157,410 →
Application: 10/518,717 →
Publication: US 2005/0209480
Processes for Manufacturing Flexible Wiring Boards
Patent: 6,848,176 →
Application: 10/640,272 →
Publication: US 2004/0045737
Flexible Wiring Boards
Patent: 7,053,312 →
Application: 10/640,401 →
Publication: US 2004/0045157
Flexible Wiring Board, an Intermediate Product of a Flexible Wiring Board, and a Multi-Layer Flexible Wiring Board
Patent: 7,186,920 →
Application: 10/784,226 →
Publication: US 2004/0163844
Releasing Composition, Thermal Transfer Recording Medium, and Thermal Transfer Protective Film
Patent: 7,267,853 →
Application: 10/896,439 →
Publication: US 2005/0031808
Thermal Transfer Protective Sheets, Prints, as Well as Prints with Window Members
Patent: 7,211,315 →
Application: 11/419,613 →
Publication: US 2006/0216482
Multilayer Printed Circuit Board and Method for Manufacturing Same
Patent: 7,963,030 →
Application: 11/720,810 →
Publication: US 2009/0288857
Releasing Composition
Patent: 7,781,524 →
Application: 11/743,445 →
Publication: US 2007/0224372
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 26, 1995
From: ABE, KENJI; SUGITA, SATORU
To: SONY CHEMICALS CORPORATION
Reel/Frame 007522/0631 →
Assignment of Assignor's Interest Aug 25, 1995
From: SAITOH, SHOSHICHI; FUJIMOTO, MASAHIRO; ORIHARA, KATSUHISA; YANAGIBORI, SUSUMU
To: SONY CHEMICALS CORPORATION
Reel/Frame 007655/0409 →
Assignment of Assignor's Interest Apr 19, 1996
From: FUJIMOTO, MASASHIRO; SIATOH, SHOSHICHI; ORIHARA, KATSUHISA; YANAGIBORI, SUSUMU
To: SONY CHEMICALS CORPORATION
Reel/Frame 007976/0511 →
Assignment of Assignor's Interest Feb 12, 1997
From: SAITOH, SHOSHICHI; FUJIMOTO, MASAHIRO; ORIHARA, KATSUHISA; YANAGIBORI, SUSUMU
To: SONY CHEMICALS CORP.
Reel/Frame 008351/0165 →
Assignment of Assignor's Interest Apr 24, 1998
From: TAKAHASHI, HIDEAKI; HARADA, TOSHIMICHI
To: SONY CHEMICALS CORP.
Reel/Frame 009268/0121 →
Assignment of Assignor's Interest Nov 1, 1999
From: SUGITA, JUNICHIRO; TAKAHASHI, HIDEAKI
To: SONY CHEMICALS CORP.
Reel/Frame 010441/0732 →
Assignment of Assignor's Interest Nov 15, 1999
From: KURITA, HIDEYUKI; TAKAHASHI, SAITOSHI; TSUTSUMI, AKIRA
To: SONY CHEMICALS CORP.
Reel/Frame 010407/0681 →
Assignment of Assignor's Interest Dec 14, 1999
From: KURITA, HIDEYUKI; WATANABE, MASANAO
To: SONY CHEMICALS CORP.
Reel/Frame 010456/0474 →
Assignment of Assignor's Interest Mar 31, 2000
From: KANEDA, YUTAKA; TSUTSUMI, AKIRA; HISHINUMA, HIROYUKI
To: SONY CHEMICALS CORP.
Reel/Frame 010666/0441 →
Assignment of Assignor's Interest Apr 18, 2000
From: KURITA, HIDEYUKI; TANIGUCHI, MASATO; NAKAMURA, MASAYUKI; HISHINUMA, HIROYUKI
To: SONY CHEMICALS CORP.
Reel/Frame 010713/0008 →
Assignment of Assignor's Interest May 11, 2000
From: KURITA, HIDEYUKI; WATANABE, MASANAO; SHINOHARA, TOSHIIHIRO; ANZAI, YUKIO
To: SONY CHEMICALS CORP.
Reel/Frame 010779/0424 →
Assignment of Assignor's Interest Jul 5, 2000
From: TSUTSUMI, AKIRA; KURITA, HIDEYUKI
To: SONY CHEMICALS CORPORATION
Reel/Frame 010951/0537 →
Assignment of Assignor's Interest Jul 7, 2000
From: KURITA, HIDEYUKI; NAKAMURA, MASAYUKI
To: SONY CHEMICALS CORP
Reel/Frame 010950/0603 →
Assignment of Assignor's Interest Aug 18, 2000
From: KURITA, HIDEYUKI; WATANABE, MASANAO
To: SONY CHEMICALS CORP.
Reel/Frame 011054/0820 →
Assignment of Assignor's Interest Oct 5, 2000
From: KURITA, HIDEYUKI; WATANABE, MASANAO; NAKAMUEA, MASAYUKI; FUKADA, MITSUHIRO
To: SONY CHEMICALS CORP.
Reel/Frame 011217/0913 →
Assignment of Assignor's Interest Oct 16, 2000
From: KURITA, HIDEYUKI; HISHINUMA, HIROYUKI
To: SONY CHEMICALS CORP.
Reel/Frame 011251/0524 →
Assignment of Assignor's Interest Oct 27, 2000
From: KANEDA, YUTAKA; NATO, KEIICHI; SHINOHARA, TOSHIHIRO
To: SONY CHEMICALS CORP.
Reel/Frame 011263/0162 →
Assignment of Assignor's Interest Nov 8, 2000
From: KISHIMOTO, SOICHIRO; HISHINUMA, HIROYUKI
To: SONY CHEMCIALS CORP.
Reel/Frame 011273/0802 →
Assignment of Assignor's Interest Dec 20, 2000
From: NAKAMURA, MASAYUKI; FUKUDA, MITSUHIRO
To: SONY CHEMICAL CORPORATION
Reel/Frame 011381/0063 →
Assignment of Assignor's Interest Feb 28, 2001
From: HISHINUMA, HIROYUKI; KURITA, HIDEYUKI; ITO, RYO; NAKAMURA, MASAYUKI
To: SONY CHEMICALS CORP.
Reel/Frame 011568/0019 →
Invalid Assignment. See Document at Reel 012176, Frame 0622. Re-Record to Correct the Microfilm Pages. May 25, 2001
From: SHIMIZU, KAZUHIRO; KOMATSU, NOBUO; KISHIMOTO, SOICHIRO
To: SONY CHEMICALS CORPORATION
Reel/Frame 011840/0744 →
Invalid Recording. See Document at Reel 012176 Frame 0622. (Re-Recorded to Correct the Microfilm Pages) May 25, 2001
From: SHIMIZU, KAZUHIRO; KOMATSU, NOBUO; KISHIMOTO, SOICHIRO
To: SONY CHEMICALS CORPORATION; SONY CORPORATION
Reel/Frame 012167/0630 →
Document Re-Recorded to Correct the Number of Microfilm Pages from 4 to 5 on Reel 11840, Frame 0744. Assignor Hereby Confirms the Assignment of the Entire Interest. May 25, 2001
From: SHIMIZU, KAZUHIRO; KOMATSU, NOBUO; KISHIMOTO, SOICHIRO
To: SONY CHEMICALS CORPORATION; SONY CORPORATION
Reel/Frame 012176/0622 →
Assignment of Assignor's Interest Jul 2, 2001
From: KANEDA, YUTAKA; NAITO, KEIICHI; KISHIMOTO, SOICHIRO; SHINOHARA, TOSHIHIRO
To: SONY CHEMICALS CORP.
Reel/Frame 011963/0509 →