Granted Patent
Utility
US 6,812,060 · App. 09/688,181
Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
Inventors:
Hideyuki Kurita, Hiroyuki Hishinuma
Patented Case
View Patent ↗
Granted: Nov 2, 2004
Filed: Oct 16, 2000
Inventors
Hideyuki Kurita
Hiroyuki Hishinuma
Assignee (at issue)
Sony Chemicals Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.