Ultrasonic manufacturing apparatus
View Patent ↗The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
1. An ultrasonic manufacturing apparatus comprising an ultrasonic wave generator generating ultrasonic vibration and a resonator transmitting said ultrasonic vibration, wherein said resonator has a plurality of projections capable of simultaneously coming into contact with a flat surface of a work, and
wherein each projection has a size expressed as a cross sectional area parallel to said flat surface of said work of 19.6×10 −8 m 2 or less at maximum.
2. The ultrasonic manufacturing apparatus according to claim 1 wherein an ultrasonic wave vibrating in a direction parallel to said flat surface of said work is applied to said each projection.
3. The ultrasonic manufacturing apparatus according to claim 1 wherein said ultrasonic wave generator is positioned oblique to said flat surface of said work.
4. The ultrasonic manufacturing apparatus according to claim 1 suitable for forming a plurality of openings in a first single-wiring layer board piece having a first patterned wiring layer and a first resin film in close contact with said first patterned wiring layer, wherein said each projection is provided at the location corresponding to the location of each bump on a second single-wiring layer board piece to be bonded to said first single-wiring layer board piece.
5. The ultrasonic manufacturing apparatus according to claim 4 wherein said resonator is replaceable.