Assignment of Assignor's Interest

Recorded: 2000-10-27 Pages: 2

Assignors

KANEDA, YUTAKA

Executed: 2000-10-17

NATO, KEIICHI

Executed: 2000-10-17

SHINOHARA, TOSHIHIRO

Executed: 2000-10-17

Assignee

SONY CHEMICALS CORP.

6-3, NIHONBASHI-MUROMACHI 1-CHOME, CHUO-KU, TOKYO 103-0022, JAPAN

Covered Property (1)

Method for Manufacturing Wiring Circuit Boards with Bumps and Method for Forming Bumps

Patent: 6,562,250 →

Application: 09/697,453 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.