Flexible wiring board, an intermediate product of a flexible wiring board, and a multi-layer flexible wiring board
View Patent ↗The flexible wiring board has a first wiring film and a second wiring film. Because the first wiring film has a larger thickness than the second wiring film, the sectional area and electrical resistance of the first wiring film can be enlarged because of the larger film thickness even in a case where the first and second wiring films have almost the same width. Therefore, a high current can flow through the first wiring film, although the wiring film has a small width. As a result, a high density of the flexible wiring board can be easily achieved.
1. A multi-layer flexible wiring board comprising a first flexible wiring board and a second flexible wiring board connecting each other, wherein
the first flexible wiring board having:
a first resin film;
a first wiring film, a bottom face of which is embedded into the first resin film;
a second wiring film, a bottom face of which is in contact with a surface of the first resin film;
a second resin film formed on a surface of the first wiring film and a surface of the second wiring film, and
at least one first opening is formed in a part of the second resin film where the first wiring film is disposed,
at least one second opening is formed in a part of the second resin film where the second wiring film is disposed,
the second flexible wiring board comprises a base film, and a wire on the base film,
wherein a face of the second flexible wiring board at a side where the wire is disposed is located toward a face of the first flexible wiring board at a side where the second resin film is disposed,
a first bump is arranged in the first opening,
the wire of the second flexible wiring board is connected to the first wiring film by the first bump,
a second bump is arranged in the second opening,
the wire of the second flexible wiring board is connected to the second wiring film by the second bump.
2. A multi-layer flexible wiring board as claimed in claim 1 , further comprising:
a third flexible wiring board having a base film, and a wire on the base film,
wherein a face of the third flexible wiring board at a side where the wire is disposed is located toward a face of the first flexible wiring board at a side where the first resin film is disposed,
at least one third opening is formed in a part of the first resin film where the first wiring film is disposed,
a third bump is arranged in the third opening,
the wire of the third flexible wiring board is connected to the first wiring film by the third bump.