Patent Assignment
Reel/Frame 018550/0258
Change of Name
Recorded: 2006-11-17
Pages: 9
Assignor
SONY CHEMICALS CORPORATION
Executed: 2006-07-01
Assignee
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
GATE CITY OSAKI EAST TOWER 8 FL., 1-11-2, OSAKI, SHINAGAWA-KU, TOKYO, JAPAN
Covered Properties
(42)
Processes for Manufacturing Multilayer Flexible Wiring Boards
Latent hardener, manufacturing method for latent hardener, and adhesive
Application:
10/309,688 →
Publication:
US 2004/0109943
Flexible Wiring Boards for Double-Side Connection
Film-Shaped Adhesive Application Apparatus
Application:
10/378,686 →
Publication:
US 2003/0178147
Method for manufacturing connection structure
Application:
10/378,975 →
Publication:
US 2003/0178132
Polarizing Plate
Latent hardener, process for producing the same, and adhesive containing latent hardener
Application:
10/504,769 →
Publication:
US 2005/0107494
Process for producing electrical apparatus
Application:
10/505,342 →
Publication:
US 2005/0257886
Two-Pack Type Adhesive
Conductive Particle and Adhesive Agent
Resin Particle, Conductive Particle and Anisotropic Conductive Adhesive Containing the Same
Perfluoropolyether Ester Compound, Lubricant and Magnetic Recording Medium
Non-Aqueous Electrolyte Battery Pack Comprising a Liquid-Absorbent Composition
Protective Element
Protective Element
Liquid Absorbing Sheet and Nonaqueous Electrolyte Battery Pack
Liquid Absorbing Sheet and Nonaqueous Electrolyte Battery Pack
Method for Establishing Anisotropic Conductive Connection and Anisotropic Conductive Adhesive Film
Method for Mounting Electronic Component
Sublimation thermal transfer recording medium and method of the thermal transfer recording therewith
Application:
10/564,810 →
Publication:
US 2006/0192841
Insulation-Coated Conductive Particle
Electroluminescence polymer, organic el device, and display
Application:
10/567,124 →
Publication:
US 2007/0032632
Latent curing agent
Application:
10/569,277 →
Publication:
US 2007/0010636
Multilayer Anisotropic Conductive Adhesive and Connection Structure Using the Same
Composition for Forming Liquid Crystal Film, Optically Anisotropic Film, and Production Method Thereof
Adhesive material and circuit connection method
Application:
10/633,614 →
Publication:
US 2004/0029992
Manufacturing Method for Electric Device
Method for Manufacturing Double-Sided Flexible Printed Board
Flexible Wiring Board, an Intermediate Product of a Flexible Wiring Board, and a Multi-Layer Flexible Wiring Board
Releasing Composition, Thermal Transfer Recording Medium, and Thermal Transfer Protective Film
Secondary Battery Devices
Transparent Conductive Films and Processes for Forming Them
Board pieces and composite wiring boards using the board pieces
Application:
11/176,756 →
Publication:
US 2005/0243528
Method for Manufacturing a Bump-Attached Wiring Circuit Board
Adhesion apparatus
Application:
11/320,404 →
Publication:
US 2006/0102073
Method and Device for Mounting Electric Component
Method of Manufacturing Hard Disc Device with a Printed Wiring Board Fixed Thereto
Compositions for Protective Films for Optical Discs
Thermal Transfer Protective Sheets, Prints, as Well as Prints with Window Members
Ester Group-Containing Poly (Imide-Azomethine) Copolymer, Ester Group-Containing Poly (Amide Acid-Azomethine) Copolymer, and Positive Photosensitive Resin Composition
Bumpless Semiconductor Device
Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
Application:
11/514,192 →
Publication:
US 2007/0104973
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 20, 2001
From: KANEDA, YUTAKA
To: SONY CHEMICALS CORP.
Reel/Frame 012420/0642 →
Assignment of Assignor's Interest
Feb 10, 2003
From: KISHIMOTO, SOICHIRO; ANZAI, YUKIO; KEINO, OSAMU
To: SONY CHEMICALS CORP.
Reel/Frame 013752/0624 →
Assignment of Assignor's Interest
Feb 10, 2003
From: MATSUSHIMA, TAKAYUKI; SAITO, MASAO
To: SONY CHEMICALS CORPORATION
Reel/Frame 013738/0579 →
Assignment of Assignor's Interest
Mar 5, 2003
From: KUMAKURA, HIROYUKI; YAMADA, YUKIO
To: SONY CHEMICALS CORP.
Reel/Frame 013855/0500 →
Assignment of Assignor's Interest
Mar 5, 2003
From: SHINOZAKI, JUNJI
To: SONY CHEMICALS CORP.
Reel/Frame 013854/0787 →
Assignment of Assignor's Interest
Jun 3, 2004
From: SEKI, KAORI; AKAMATSU, TADASHI; SHI, ZEMIN; TORISU, HIROYUKI
To: SONY CHEMICALS CORP.
Reel/Frame 016045/0552 →
Assignment of Assignor's Interest
Jun 3, 2004
From: SEKI, KAORI; AKAMATSU, TADASHI; SHI, ZEMIN; TORISU, HIROYUKI
To: SONY CHEMICALS CORP.
Reel/Frame 015723/0257 →
Assignment of Assignor's Interest
Aug 17, 2004
From: MATSUSHIMA, TAKAYUKI; SAITO, MASAO
To: SONY CHEMICALS CORPORATION
Reel/Frame 016234/0741 →
Assignment of Assignor's Interest
Aug 20, 2004
From: MATSUSHIMA, TAKAYUKI; SAITO, MASAO
To: SONY CHEMICALS CORPORATION
Reel/Frame 016143/0880 →
Assignment of Assignor's Interest
Dec 1, 2004
From: MATSUSHIMA, TAKAYUKI; SAITO, MASAO
To: SONY CHEMICALS CORPORATION
Reel/Frame 016041/0799 →
Assignment of Assignor's Interest
Dec 22, 2004
From: NAKATA, YOSHIAKI
To: SONY CHEMICALS CORP.
Reel/Frame 016692/0485 →
Assignment of Assignor's Interest
Dec 28, 2004
From: NOMURA, MAMIKO; SAMUKAWA, HIROSHI
To: SONY CHEMICALS CORP.
Reel/Frame 016919/0744 →
Assignment of Assignor's Interest
Jan 12, 2005
From: KAMIYA, KAZUNOBU; KAMIYA, RYOJI
To: SONY CHEMICALS CORPORATION
Reel/Frame 015555/0016 →
Assignment of Assignor's Interest
Jun 8, 2005
From: FURUUCHI, YUJI
To: SONY CHEMICALS CORP.
Reel/Frame 017102/0268 →
Assignment of Assignor's Interest
Jun 10, 2005
From: FURUUCHI, YUJI; TAMURA, HISAYA; MATSUYOSHI, MASAHIRO; FURUTA, KAZUTAKA
To: SONY CHEMICALS CORP.
Reel/Frame 017384/0015 →
Assignment of Assignor's Interest
Jul 25, 2005
From: MORIYAMA, HIRONOBU; FUJITA, YASUHIRO; NOMURA, MAMIKO; HATSUDA, KOUKI
To: SONY CHEMICALS CORP.
Reel/Frame 017291/0398 →
Assignment of Assignor's Interest
Sep 23, 2005
From: SONY CHEMICALS CORP.
To: SONY CORPORATION
Reel/Frame 016840/0619 →
Assignment of Assignor's Interest
Oct 18, 2005
From: HATSUDA, KOUKI; FUJITA, YASUHIRO; MORIYAMA, HIRONOBU; NOMURA, MAMIKO
To: SONY CHEMICALS CORP.
Reel/Frame 017774/0411 →
Assignment of Assignor's Interest
Oct 31, 2005
From: YAMADA, YUKIO
To: SONY CORPORATION
Reel/Frame 017158/0109 →
Assignment of Assignor's Interest
Nov 22, 2005
From: KONISHI, MISAO
To: SONY CHEMICALS CORP.
Reel/Frame 017859/0391 →
Assignment of Assignor's Interest
Dec 15, 2005
From: KONISHI, MISAO; NAMIKI, HIDETSUGU; SHINOZAKI, JYUNJI
To: SONY CHEMICALS CORPORATION
Reel/Frame 017384/0832 →
Change in Assignee's Name and Address "Sony Corporation, 7-35 Kitashinagawa 6-Chome, Shinagawa-Ku, Tokyo 141-0011, Japan" to-Sony Chemicals Corporation, Gate City Osaki, Shinagawa-Ku, 1-11-2, Osaki, Shinagawa-Ku, Tokyo 141-0032, Japan-. Previously Recorded on Reel 017158 Frame 0109
Mar 3, 2006
From: YAMADA, YUKIO
To: SONY CHEMICALS CORPORATION
Reel/Frame 017653/0798 →
Assignment of Assignor's Interest
Nov 21, 2006
From: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
To: SONY CORPORATION; SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Reel/Frame 018559/0268 →
Assignment of Assignor's Interest
Mar 27, 2007
From: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
To: SONY CORPORATION
Reel/Frame 019068/0646 →
Assignment of Assignor's Interest
May 9, 2007
From: SONY CHEMICAL & INFORMATON DEVICE CORPORATION
To: SONY CORPORATION
Reel/Frame 019272/0853 →