Conductive particle and adhesive agent
View Patent ↗A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first resin coating disposed on the periphery of the resin particle. The first resin coating being softer than the resin particle. A second conductive thin film is disposed therearound. When the surface part of an electrode of an adherend that is to be connected is hard, a first resin coating of the conductive particle and the second conductive thin film are destroyed by pressure to bring the second conductive thin film in contact with the electrode and a metal wiring. If the surface part of the electrode is soft, the second conductive thin film on the surface side comes in contact with the electrode, which makes it possible for the particle to be used regardless of the surface state of an adherend.
1. A conductive particle comprising:
a resin particle,
a first conductive thin film disposed around said resin particle,
a first resin coating disposed around said first conductive thin film, and
a second conductive thin film disposed around said first resin coating,
wherein said resin particle is formed of a resin that is harder than said first resin coating,
wherein said first and second conductive thin films are composed of a nickel coating, and a gold coating formed on the surface of said nickel coating.
2. A conductive particle according to claim 1 , wherein the thickness of said first resin coating is 1/20 times or more and 6 times or less the diameter of said resin particle, and the thickness of said first resin coating is 0.1 μm or more.
3. A conductive particle according to claim 1 , wherein the thickness of said second conductive thin film is 0.05 μm or more and 0.3 μm or less.
4. A conductive particle according to claim 1 , wherein a second resin coating is formed around said second conductive thin film.
5. A conductive particle according to claim 1 ,
wherein the sum of the weight of said first conductive thin film and the weight of said second conductive thin film is equal to or more that 40% of the weight of the whole of said conductive particle;
the thickness of said first conductive thin film is 1/100 or more and ½ or less the diameter of said resin particle.
6. A conductive particle according to claim 1 , wherein at least one convex portion is formed on the surface of said first conductive thin film on the side where said first resin coating has been disposed.
7. A conductive particle according to claim 6 , wherein the average number of said convex portions formed on the surface of said first conductive thin film is five or more.
8. A conductive particle according to claim 6 , wherein the average height of said convex portions formed on the surface of said first conductive thin film is 0.05 μm or more.
9. An adhesive comprising: a binder containing thermoplastic resin, and a conductive particle according to claim 1 .
10. A conductive particle comprising:
a resin particle,
a first conductive thin film disposed around said resin particle,
a first resin coating disposed around said first conductive thin film, and
a second conductive thin film disposed around said first resin coating,
wherein said resin particle is formed of a resin that is harder than said first resin coating, and
wherein at least one convex portion is formed on the surface of said first conductive thin film on the side where said first resin coating has been disposed.
11. A conductive particle according to claim 10 , wherein the average number of said convex portions formed on the surface of said first conductive thin film is five or more.
12. A conductive particle according to claim 10 , wherein the average height of said convex portions formed on the surface of said first conductive thin film is 0.05 μm or more.
13. An adhesive comprising: a binder containing thermoplastic resin, and a conductive particle according to claim 10 .