Method of manufacturing hard disc device with a printed wiring board fixed thereto
View Patent ↗An insulating sheet is manufactured by attaching a buffer layer and a resin film using an adhesive layer that is not adhesive at a normal ambient temperature. Since there is no need to use a release liner when manufacturing the insulating sheet, there is no release of a silicone component. Accordingly, when installing a hard disk printed wiring board, the printed wiring board and electronic circuits inside the hard disk will not be damaged by the released silicone.
1. A method of manufacturing a hard disc device with a printed wiring board fixed to, comprising the steps of:
attaching an adhesive layer in advance to an insulating resin film to form an adhesive film, wherein the adhesive layer has adhesiveness exhibiting temperature higher than normal ambient temperature;
winding the adhesive film up to form a roll of the adhesive film so that an exposed surface of the adhesive layer is in contact with the resin film;
unwinding the adhesive film from the roll;
bringing the exposed surface of the adhesive layer into contact with a buffer layer having elastic attributes and heating the adhesive layer while pressing against the buffer layer; thereby attaching the resin film to the buffer layer with the adhesive layer to form an insulating sheet; and
fastening the printed wiring board to a case of the hard disc device in a state that the insulating sheet is located between the printed wiring board and the case of the hard disc device.
2. The method of manufacturing a hard disc device with a printed wiring board fixed to according to claim 1 , further comprising the step of
die-cutting the insulating sheet, wherein the insulating sheet located between the printed wiring board and the case is the insulating sheet die-cutted.
3. The method of manufacturing a hard disc device with a printed wiring board fixed to according to claim 2 , wherein the buffer layer side of the insulating sheet located between the printed wiring board and the case is brought into contact with the printed wiring board and the resin film side of the insulating sheet located between the printed wiring board and the case is brought into contact with the case.
4. The method of manufacturing a hard disc device with a printed wiring board fixed to according to claim 1 , wherein the adhesive layer is formed of resin that does not contain a silicone component.
5. The method of manufacturing a hard disc device with a printed wiring board fixed to according to claim 4 , wherein the adhesive layer is formed from polyester resin.
6. The method of manufacturing a hard disc device with a printed wiring board fixed to according to claim 1 , wherein the resin film is formed from polyethylene terephthalate.
7. The method of manufacturing a hard disc device with a printed wiring board fixed to according to claim 1 , wherein the buffer layer is formed of urethane foam.