IP Library Patent Application 10504769
Patent Application
App. No. 10/504,769

Latent hardener, process for producing the same, and adhesive containing latent hardener

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Quick Facts
Patent No.
US None
App. No.
10/504,769
Abstract

A latent curing agent ( 30 ) of the present invention includes a core member ( 31 ) and a capsule ( 37 ) covering up the surface of the core member ( 31 ). The core member ( 31 ) includes a secondary particle ( 32 ) and a curing agent ( 35 ) retained in a gap ( 38 ) of the secondary particle ( 32 ). The curing agent ( 35 ) is liquid at ambient temperature. When the capsule ( 37 ) is destructed so that the curing agent ( 35 ) is emitted into an adhesive, the curing agent ( 35 ) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent ( 35 ), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent ( 35 ) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.

Claims (30)

1 . A latent curing agent comprising a core member containing a curing agent, and a capsule which covers up said core member, said curing agent being emitted to outside from said core member on destruction of said capsule, wherein said core member has a plurality of particles and said curing agent is retained between gaps of said particles.

2 . The latent curing agent according to claim 1 wherein said plural particles coalesce together to form a secondary particle.

3 . The latent curing agent according to claim 2 wherein the average particle size of each particle making up the secondary particle is equal to or greater than 0.1 μm and equal to or less than 1.0 μm; and

wherein the average particle size of said secondary particle is equal to or greater than 1 μm and equal to or less than 20 μm.

4 . The latent curing agent according to claim 1 wherein the particle forming said secondary particle is a resin particle.

5 . The latent curing agent according to claim 4 wherein the resin making up the resin particles is a urea formalin resin.

6 . The latent curing agent according to claim 1 wherein the weight of the curing agent retained in said capsule is equal to or greater than 15 wt % of the weight of said secondary particle.

7 . The latent curing agent according to claim 1 wherein the curing agent is one or both of a metal chelate and a metal alcoholate.

8 . The latent curing agent according to claim 7 wherein the metal chelate is one or both of an aluminum chelate or a titanium chelate.

9 . The latent curing agent according to claim 8 wherein the metal alcoholate is formed of one or both of an aluminum alcoholate and a titanium alcoholate as main ingredient.

10 . A latent curing agent comprising a core member containing a curing agent, and a capsule which covers up said core member, said curing agent being emitted to outside from said core member on destruction of said capsule, wherein said core member has a porous particle and said curing agent is retained in said porous particle.

11 . The latent curing agent according to claim 10 wherein said porous particle is formed of zeolite.

12 . The latent curing agent according to claim 10 wherein the weight of said curing agent retained in said capsule is equal to or greater than 15 wt % of the weight of said porous particle.

13 . The latent curing agent according to claim 10 wherein the curing agent is one or both of a metal chelate and a metal alcoholate.

14 . The latent curing agent according to claim 13 wherein the metal chelate is one or both of an aluminum chelate and a titanium chelate.

15 . The latent curing agent according to claim 14 wherein the metal alcoholate is formed of one or both of an aluminum alcoholate and a titanium alcoholate as main ingredient.

16 . A method for the preparation of a latent curing agent comprising:

a mixing step of mixing a carrier having a gap in its inner structure and a liquid curing agent to form a core member made up by said carrier and said curing agent retained in said carrier;

a depositing step of mixing said core member and a capsule resin particle to cause the capsule resin particle to be deposited on the surface of said core member; and

a fusing step of fusing said capsule resin particle, deposited to said core member, to form a capsule covering up the surface of said core member.

17 . The method for the preparation of a latent curing agent according to claim 16 wherein said carrier is rinsed after said mixing step.

18 . The method for the preparation of a latent curing agent according to claim 16 wherein said fusing step is carried out by stirring the core member to which is affixed said capsule resin particle.

19 . An adhesive comprising:

a thermosetting resin;

a silane coupling agent; and

a latent curing agent including a core member containing a curing agent, and a capsule which covers up said core member, said curing agent being emitted to outside from said core member on destruction of said capsule, said core member having a plurality of particles and said curing agent is retained between gaps of said particles.

20 . An adhesive comprising:

a thermosetting resin;

a silane coupling agent; and

a latent curing agent including a core member containing a curing agent and a capsule which covers up said core member, said curing agent being emitted to outside from said core member on destruction of said capsule, said core member having a porous particle and said curing agent is retained in said porous particle.

Assignments (2)
CHANGE OF NAME Recorded Nov 17, 2006
From: SONY CHEMICALS CORPORATION
To: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Reel/Frame 018550/0258 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2004
From: MATSUSHIMA, TAKAYUKI; SAITO, MASAO
To: SONY CHEMICALS CORPORATION
Reel/Frame 016234/0741 →