Adhesion apparatus
A method of adhesion inhibiting generation of bubbles is provided. Heating, evacuation and centrifugal degassing are performed on an adhesive 37 disposed in an adhesive container 30 to semi-harden the adhesive 37 , then a semi-hardened adhesive is discharged as disposed in the adhesive container 30 to mount a chip. Removal of bubbles is efficiently performed since semi-hardening and degassing are simultaneously performed. Further, no defective product is produced even if a working process is stopped since no process for semi-hardening a discharged adhesive exists.
1 .- 10 . (canceled)
11 . An adhesion apparatus comprising an adhesive container connected to a pore and an adhesive disposed in said adhesive container and being constituted such that a desired amount of said adhesive can be discharged from said pore, wherein said adhesive is disposed in said adhesive container, and has been vacuum-degassed by an applied centrifugal force while being heated in the state placed in a vacuum atmosphere.
12 . The adhesion apparatus according to claim 11 , wherein said adhesive is semi-hardened at a reaction rate ranging from 2% or more to 20% or less.