Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
1 . A low-temperature setting adhesive, comprising as main components:
a cured product of an epoxy acrylate represented by the following formula:
a resin component having no unsaturated double bond;
a bis(methacryloyloxyethyl) hydrogen phosphate; and
a radical polymerization initiator,
wherein the epoxy acrylate is present in the amount of 15-85% by weight of adhesive, the resin component having no unsaturated double bond is present in the amount of 30 to 90% by weight of the adhesive, and the bis(methacryloyloxyethyl) hydrogen phosphate is present in the amount of 0.01 to 20% by weight of the adhesive, and wherein n has a value in the range from 0-6.
2 . The low-temperature setting adhesive according to claim 1 , wherein a phosphate-based coupling agent is further mixed therein.
3 . The low-temperature setting adhesive according to claim 1 , wherein said bis(methacryloyloxyethyl) hydrogen phosphate component has a radical polymerizable reactive group.
4 . The low-temperature setting adhesive according to claim 2 , wherein said bis(methacryloyloxyethyl) hydrogen phosphate component has a radical polymerizable reactive group.
5 . An anisotropically electroconductive adhesive, comprising:
a low-temperature setting adhesive, comprising as main components: a cured product of an epoxy acrylate represented by the following formula:
a resin component having no unsaturated double bond,
a bis(methacryloyloxyethyl) hydrogen phosphate,
a radical polymerization initiator; and
an electroconductive particle being dispersed in said low-temperature setting adhesive,
wherein the epoxy acrylate is present in the amount of 15-85% by weight of adhesive, the resin component having no unsaturated double bond is present in the amount of 30 to 90% by weight of the adhesive, and the bis(methacryloyloxyethyl) hydrogen phosphate is present in the amount of 0.01 to 20% by weight of the adhesive, and wherein n has a value in the range from 0-6.
6 . The anisotropically electroconductive adhesive according to claim 5 , wherein a phosphate-based coupling agent is further mixed in said low-temperature setting adhesive.
7 . The anisotropically electroconductive adhesive according to claim 5 , wherein said bis(methacryloyloxyethyl) hydrogen phosphate component has a radical polymerizable reactive group.
8 . The anisotropically electroconductive adhesive according to claim 6 , wherein said bis(methacryloyloxyethyl) hydrogen phosphate component has a radical polymerizable reactive group.
9 . The anisotropically electroconductive adhesive according to claim 5 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.
10 . The anisotropically electroconductive adhesive according to claim 6 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.
11 . The anisotropically electroconductive adhesive according to claim 7 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.
12 . The anisotropically electroconductive adhesive according to claim 8 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.
13 . The anisotropically electroconductive adhesive according to claim 9 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.
14 . The anisotropically electroconductive adhesive according to claim 10 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.
15 . The anisotropically electroconductive adhesive according to claim 11 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.
16 . The anisotropically electroconductive adhesive according to claim 12 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.
17 . An insulating adhesive film, comprising:
a peeling sheet; and
a low-temperature setting adhesive, said adhesive being provided on said sheet by coating and drying, and comprising as main components: a cured product of an epoxy acrylate represented by the following formula:
a resin component having no unsaturated double bond, a bis(methacryloyloxyethyl) hydrogen phosphate, and a radical polymerization initiator.
18 . The insulating adhesive film according to claim 17 , wherein a phosphate-based coupling agent is further mixed therein.
19 . The insulating adhesive film according to claim 17 , wherein said bis(methacryloyloxyethyl) hydrogen phosphate component has a radical polymerizable reactive group.
20 . The insulating adhesive film according to claim 18 , wherein said bis(methacryloyloxyethyl) hydrogen phosphate component has a radical polymerizable reactive group.
21 . An anisotropically electroconductive adhesive film, comprising:
a peeling sheet;
a low-temperature setting adhesive provided on said sheet by coating and drying, and comprising as main components: a cured product of an epoxy acrylate represented by the following formula:
a resin component having no unsaturated double bond, a bis(methacryloyloxyethyl) hydrogen phosphate, and a radical polymerization initiator; and
an electroconductive particle dispersed in said low-temperature setting adhesive.
22 . The anisotropically electroconductive adhesive film according to claim 21 , wherein a phosphate-based coupling agent is further mixed in said low-temperature setting adhesive.
23 . The anisotropically electroconductive adhesive film according to claim 21 , wherein said bis(methacryloyloxyethyl) hydrogen phosphate component has a radical polymerizable reactive group.
24 . The anisotropically electroconductive adhesive film according to claim 22 , wherein said bis(methacryloyloxyethyl) hydrogen phosphate component has a radical polymerizable reactive group.
25 . The anisotropically electroconductive adhesive film according to claim 21 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.
26 . The anisotropically electroconductive adhesive film according to claim 22 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.
27 . The anisotropically electroconductive adhesive film according to claim 23 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.
28 . The anisotropically electroconductive adhesive film according to claim 24 , wherein said electroconductive particle comprises a resin particle which is deformed when applied with pressure as a nucleus, and an electroconductive metal thin layer provided on a surface layer portion thereof.
29 . The anisotropically electroconductive adhesive film according to claim 25 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.
30 . The anisotropically electroconductive adhesive film according to claim 26 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.
31 . The anisotropically electroconductive adhesive film according to claim 27 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.
32 . The anisotropically electroconductive adhesive film according to claim 28 , wherein an insulating layer is provided on said metal thin layer of said electroconductive particle.
33 . The low-temperature setting adhesive according to claim 1 , wherein the resin component having no unsaturated double bond is present in the amount of 30-80% by weight of the adhesive.
34 . The anisotropicallly electroconductive adhesive according to claim 5 , wherein the resin component having no unsaturated double bond is present in the amount of 30-80% by weight of the adhesive.