IP Library Granted Patent US 7,781,524
Granted Patent B2
US 7,781,524 · App. 11/743,445 · Granted Aug 24, 2010

Releasing composition

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Quick Facts
Patent No.
US 7,781,524
App. No.
11/743,445
Granted
Aug 24, 2010
Kind
B2
Abstract

A releasing composition capable of improving abrasion resistance includes a releasing composition containing releasing particles in a film forming material, and the releasing particle has a first releasing resin as a core material and a second releasing resin as a coating material. The first releasing resin has a relatively higher releasing property than the second releasing resin. The first releasing resin can include a surface tension of from about 0.01 N/m to about 0.025 N/m, and the second releasing resin may have a surface tension of from about 0.026 N/m to about 0.05 N/m.

Claims (8)

1. A releasing composition comprising releasing particles in an acrylic film forming resin, the releasing particles comprising:

a first releasing resin as a core material; and

a second releasing resin as a coating material, that envelops the core material,

wherein the first releasing resin has a relatively higher releasing property than the second releasing resin.

2. The releasing composition according to claim 1 , wherein the first releasing resin has a surface tension of about 0.01 N/m to about 0.025 N/m.

3. The releasing composition according to claim 1 , wherein the second releasing resin has a surface tension of about 0.026 N/m to about 0.05 N/m.

4. The releasing composition according to claim 1 , wherein the first releasing resin contains at least any one of polytetrafluoroethylene and silicone.

5. The releasing composition according to claim 1 , wherein the second releasing resin contains at least any one of polyethylene and polypropylene.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2012
From: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
To: SONY CORPORATION
Reel/Frame 029445/0268 →