Patent Assignment
Reel/Frame 011217/0913
Assignment of Assignor's Interest
Recorded: 2000-10-05
Pages: 3
Assignors
KURITA, HIDEYUKI
Executed: 2000-08-02
WATANABE, MASANAO
Executed: 2000-08-01
NAKAMUEA, MASAYUKI
Executed: 2000-08-01
FUKADA, MITSUHIRO
Executed: 2000-08-01
USUI, HIROYUKI
Executed: 2000-08-01
Assignee
SONY CHEMICALS CORP.
CHUO-KU, 6-3, NIHONBASHIMUROMACHI 1-CHOME, TOKYO 103-8312, JAPAN
Covered Property
(1)
Multilayer Flexible Wiring Boards Including Malleable Resin Layer Manufactured with the Use of Ultrasonic Wave
Patent:
6,583,364 →
Application:
09/642,638 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.