Assignment of Assignor's Interest

Recorded: 2001-06-29 Received: 2001-07-16 Pages: 3

Assignors

LOBIANCO, ANTHONY J.

Executed: 2001-06-25

JUSKEY, FRANK

Executed: 2001-06-26

SCHOONEJONGEN, RONALD J.

Executed: 2001-06-26

Assignee

AMKOR TECHNOLOGY, INC.

1900 SOUTH PRICE ROAD, CHANDLER, AZ, 85248, UNITED STATES

Covered Properties (2)

Method for Molding Semiconductor Package Having a Ceramic Substrate

Application: 09/895,767 →

Quick Disconect Assembly

Application: 09/813,364 →