Granted Patent
Utility
US 6,534,338
· Confirmation No. 6924
METHOD FOR MOLDING SEMICONDUCTOR PACKAGE HAVING A CERAMIC SUBSTRATE
Patented Case
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-06-29 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-06-29 | SPEC |
Specification | 13 | View | |
| 2001-06-29 | CLM |
Claims | 6 | View | |
| 2001-06-29 | ABST |
Abstract | 1 | View | |
| 2001-06-29 | DRW |
Drawings-only black and white line drawings | 13 | View | |
| 2001-06-29 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Attorneys & Agents of Record
Classification
USPC
257/107
H10W74/016
H10W90/754
Prosecution
- Examiner
- HO, TU TU V
- Art Unit
- 2818
- Customer No.
- 22888
- Docket No.
- M-11314 US
- Confirmation No.
- 6924
Patent Term Adjustment
-92days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2020-10-09
TERMINATION & RELEASE OF PATENT SECURITY AGREEMENT
Recorded 2006-01-03
SECURITY AGREEMENT
Recorded 2004-11-02
SECURITY AGREEMENT
Recorded 2004-07-06
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-06-29
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Quick Facts
- Patent No.
- US 6,534,338
- App. No.
- 09/895,767
- Filed
- 2001-06-29
- Granted
- 2003-03-18
- Examiner
- HO, TU TU V
- Art Unit
- 2818
- PTA
- -92 days
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