Patent Assignment
Reel/Frame 015942/0521
Security Agreement
Recorded: 2004-11-02
Received: 2004-11-05
Pages: 22
Assignee
CITICORP NORTH AMERICA, INC. AS "AGENT"
390 GREENWICH STREET, 1345 ENTERPRISE DRIVE, NEW YORK, NY, 10013, UNITED STATES
Covered Properties
(97)
Leadframe Package for Semiconductor Devices
Application:
10/387,801 →
Semiconductor Package Capable of Die Stacking
Application:
10/376,988 →
Method of Making a Semiconductor Package Having Exposed Metal Strap
Application:
10/356,046 →
Mounting for a Package Containing a Chip
Application:
10/340,256 →
Pre-Molded Leadframe
Application:
10/329,620 →
Semiconductor Package and Method for Fabricating the Same
Application:
10/306,627 →
Image Sensor Package
Application:
10/286,589 →
Semiconductor Device Including Metal Strap Electrically Coupled Between Semiconductor Die and Metal Leadframe
Application:
10/256,905 →
Lead-Frame Method and Circuit Module Assembly Including Edge Stiffener
Application:
10/251,410 →
Optic Semiconductor Package
Application:
10/227,054 →
Method of Making a Semiconductor Package Including Stacked Semiconductor Dies
Application:
10/224,864 →
Integrated Circuit Having Multiple Power/Ground Connections to a Single External Terminal and Method Therefor
Application:
10/223,749 →
Plastic Integrated Circuit Package and Leadframe for Making the Package
Application:
10/171,702 →
Injection Molded Lens-Barrel Assembly and Method for Fabricating Lens-Barrel and Mount Assemblies
Application:
10/161,963 →
Semiconductor Package Including Isolated Ring Structure
Application:
10/142,222 →
Lead Frame with Plated End Leads and Recesses
Application:
10/122,598 →
Shield Cap and Semiconductor Package Including Shield Cap
Application:
10/121,215 →
Carrier Frame and Semiconductor Package Including Carrier Frame
Application:
10/115,218 →
Semiconductor Package and Method for Manufacturing the Same
Application:
10/103,048 →
Low Profile Mounting of Thick Integrated Circuit Packages Within Low-Profile Circuit Modules
Application:
10/094,731 →
Thin Semiconductor Package with Semiconductor Chip and Electronic Discrete Device
Application:
10/086,293 →
Enhanced Chip Scale Package for Wire Bond Dies
Application:
10/078,718 →
Thin Integrated Circuit Package Having an Optically Transparent Window
Application:
10/067,068 →
Integrated Circuit Package Mounting
Application:
10/068,717 →
Semiconductor Package Including Rings Structure Connected to Leads with Vertically Downset Inner Ends
Application:
10/054,124 →
Optical Device Packages Having Improved Conductor Efficiency, Optical Coupling and Thermal Transfer
Application:
10/046,995 →
Sensor Module with Integrated Discrete Components
Application:
10/012,378 →
Lead Frame for Semiconductor Package
Application:
10/013,160 →
Structures for Improving Heat Dissipation in Stacked Semiconductor Packages
Application:
10/013,396 →
Printed Circuit Board with Integral Heat Sink for Semiconductor Package
Application:
10/006,642 →
Multi-Layer Lead Frame Structure
Application:
09/996,226 →
Power Semiconductor Package with Strap
Application:
10/008,048 →
Method of Making an Integrated Circuit Package
Application:
10/007,337 →
Semiconductor Package with Optimized Leadframe Bonding Strength
Application:
09/998,844 →
Apparatus and Method for Allowing Testing of Semiconductor Devices at Different Temperatures
Application:
09/978,535 →
Semiconductor Package with Singulation Crease
Application:
09/976,866 →
Semiconductor Package Having Stacked Semiconductor Chips and Method of Making the Same
Application:
09/974,541 →
Semiconductor Package Having Multiple Dies with Independently Biased Back Surfaces
Application:
09/953,422 →
Quick Sealing Glass-Lidded Package
Application:
09/946,750 →
Quick Sealing Glass-Lidded Package Fabrication Method
Application:
09/946,861 →
Method and Circuit Module Package for Automated Switch Actuator Insertion
Application:
09/934,040 →
Semiconductor Package Having Substrate with Laser-Formed Aperture Through Solder Mask Layer
Application:
09/932,528 →
Solderable Injection-Molded Integrated Circuit Substrate and Method Therefor
Application:
09/931,144 →
Integrated Circuit Package Including Pin and Barrel Interconnects
Application:
09/932,109 →
Laser Defined Pads for Flip Chip on Leadframe Package
Application:
09/929,239 →
Laser Defined Pads for Flip Chip on Leadframe Package Fabrication Method
Application:
09/929,428 →
Reduced Thickness Packaged Electronic Device
Application:
09/916,716 →
Pre-Drilled Ball Grid Array Package
Application:
09/916,848 →
Method for Forming a Reduced Thickness Packaged Electronic Device
Application:
09/916,719 →
Integrated Circuit Chip Package Having an Internal Lead
Application:
09/909,160 →
Method of Fabricating and Using an Image Sensor Package with Reflector
Application:
09/906,868 →
Image Sensor Package with Reflector
Application:
09/906,992 →
Method for Molding Semiconductor Package Having a Ceramic Substrate
Application:
09/895,767 →
Pre-Drilled Image Sensor Package Fabrication Method
Application:
09/896,074 →
Pre-Drilled Image Sensor Package
Application:
09/895,994 →
Method for Forming an Image Sensor Package with Vision Die in Lens Housing
Application:
09/896,014 →
Structure for Backside Saw Cavity Protection
Application:
09/895,996 →
Optical Track Drain Package
Application:
09/891,678 →
Method of Making a Chip Carrier Package Using Laser Ablation
Application:
09/888,950 →
Method and Apparatus for Attaching Multiple Metal Components to Integrated Circuit Modules
Application:
09/884,357 →
Hermetic Ceramic Semiconductor Package
Application:
09/881,343 →
Personalized Circuit Module Package and Method for Packaging Circuit Modules
Application:
09/880,277 →
Image Sensing Component Package and Manufacture Method Thereof
Application:
09/871,993 →
Active Heat Sink for Cooling a Semiconductor Chip
Application:
09/866,100 →
Plastic Integrated Circuit Device Package Having Exposed Lead Surface
Application:
09/863,359 →
Multi-Chip Semiconductor Package with Integral Shield and Antenna
Application:
09/855,244 →
Sheet Resin Composition
Application:
09/851,564 →
Shielded Semiconductor Package with Single-Sided Substrate and Method for Making the Same
Application:
09/848,932 →
Shielded Semiconductor Leadframe Package
Application:
09/848,864 →
Heat Spreader with Spring Ic Package Fabrication Method
Application:
09/839,288 →
Heat Spreader with Spring Ic Package
Application:
09/839,284 →
Method of Making a Plastic Pakage for an Optical Integrated Circuit Device
Application:
09/839,861 →
Vacuum Sealed Package for Semiconductor Chip
Application:
09/839,305 →
Stackable Lead Frame Package Using Exposed Internal Lead Traces
Application:
09/829,341 →
Making Leadframe Semiconductor Packages with Stacked Dies and Interconnecting Interposer
Application:
09/828,046 →
Making Two Lead Surface Mounting High Power Microleadframe Semiconductor Packages
Application:
09/827,791 →
Making Semiconductor Devices Having Stacked Dies with Biased Back Surfaces
Application:
09/828,396 →
Semiconductor Package with Molded Substrate and Recessed Input/Output Terminals
Application:
09/827,619 →
Thermally Enhanced Chip Scale Lead on Chip Semiconductor Package
Application:
09/825,785 →
Semiconductor Package Including Stacked Chips with Aligned Input/Output Pads
Application:
09/816,599 →
Mounting for a Package Containing a Chip
Application:
09/813,485 →
Semiconductor Package with Warpage Resistant Substrate
Application:
09/812,426 →
Structure for Protecting a Micromachine with a Cavity in a Uv Tape
Application:
09/811,183 →
Micromirror Device Package
Application:
09/804,749 →
Micromirror Device Package Fabrication Method
Application:
09/804,805 →
Structure Including Electronic Components Singulated Using Laser Cutting
Application:
09/797,759 →
Method of Singulation Using Laser Cutting
Application:
09/797,756 →
Printed Circuit Board for Semiconductor Package and Method for Manufacturing the Same
Application:
09/783,797 →
Semiconductor Package Having Semiconductor Chip Within Central Aperture of Substrate
Application:
09/774,952 →
Semiconductor Module Package Substrate
Application:
09/770,859 →
Semiconductor Module Package Substrate Fabrication Method
Application:
09/770,861 →
Structure for Fabricating a Special-Purpose Die Using a Polymerizable Tape
Application:
09/764,190 →
Method for Fabricating a Special-Purpose Die Using a Polymerizable Tape
Application:
09/764,166 →
Optical Module with Lens Integral Holder
Application:
09/764,165 →
Method for Forming a Bond Wire Pressure Sensor Die Package
Application:
09/754,229 →
Method for Forming a Flip Chip Pressure Sensor Die Package
Application:
09/754,239 →
Bond Wire Pressure Sensor Die Package
Application:
09/754,393 →