IP Library Granted Patent US 6,432,737
Granted Patent Utility
US 6,432,737 · Confirmation No. 2598

METHOD FOR FORMING A FLIP CHIP PRESSURE SENSOR DIE PACKAGE

Inventor: Steven Webster
Patented Case View Patent ↗
⬇ PDF
Code Description Pages PDF
2001-04-09 DRW Drawings-only black and white line drawings 16 View
2001-01-03 TRNA Transmittal of New Application 3 View
2001-01-03 SPEC Specification 26 View
2001-01-03 CLM Claims 10 View
2001-01-03 ABST Abstract 1 View
2001-01-03 DRW Drawings-only black and white line drawings 26 View
2001-01-03 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,432,737
App. No.
09/754,239
Filed
2001-01-03
Granted
2002-08-13
Art Unit
2818
PTA
-121 days