Patent Assignment
Reel/Frame 054036/0599
Assignment of Assignor's Interest
Recorded: 2020-10-09
Received: 2020-10-09
Pages: 49
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2019-11-19
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
491 B RIVER VALLEY ROAD, #15-02/04, VALLEY POINT, SGX, 248373, SINGAPORE
Covered Properties
(20)
Touch Screen Device
Application:
14/105,903 →
Semiconductor Package Having Multiple Dies with Independently Biased Back Surfaces
Application:
09/953,422 →
Integrated Circuit Package Including Pin and Barrel Interconnects
Application:
09/932,109 →
Pre-Drilled Ball Grid Array Package
Application:
09/916,848 →
Method for Forming a Reduced Thickness Packaged Electronic Device
Application:
09/916,719 →
Method and Apparatus for Attaching Multiple Metal Components to Integrated Circuit Modules
Application:
09/884,357 →
Active Heat Sink for Cooling a Semiconductor Chip
Application:
09/866,100 →
Method of Making a Plastic Pakage for an Optical Integrated Circuit Device
Application:
09/839,861 →
Making Semiconductor Devices Having Stacked Dies with Biased Back Surfaces
Application:
09/828,396 →
Semiconductor Package with Warpage Resistant Substrate
Application:
09/812,426 →
Micromirror Device Package
Application:
09/804,749 →
Structure Including Electronic Components Singulated Using Laser Cutting
Application:
09/797,759 →
Method of Singulation Using Laser Cutting
Application:
09/797,756 →
Controlled-Shaped Solder Reservoirs for Increasing the Volume of Solder Bumps
Application:
09/790,421 →
Printed Circuit Board for Semiconductor Package and Method for Manufacturing the Same
Application:
09/783,797 →
Semiconductor Module Package Substrate
Application:
09/770,859 →
Semiconductor Module Package Substrate Fabrication Method
Application:
09/770,861 →
Method for Forming a Bond Wire Pressure Sensor Die Package
Application:
09/754,229 →
Method for Forming a Flip Chip Pressure Sensor Die Package
Application:
09/754,239 →
Bond Wire Pressure Sensor Die Package
Application:
09/754,393 →