IP Library Granted Patent US 6,494,361
Granted Patent Utility
US 6,494,361 · Confirmation No. 7221

SEMICONDUCTOR MODULE PACKAGE SUBSTRATE FABRICATION METHOD

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Code Description Pages PDF
2001-05-10 DRW Drawings-only black and white line drawings 5 View
2001-01-26 TRNA Transmittal of New Application 3 View
2001-01-26 SPEC Specification 21 View
2001-01-26 CLM Claims 6 View
2001-01-26 ABST Abstract 1 View
2001-01-26 DRW Drawings-only black and white line drawings 8 View
2001-01-26 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,494,361
App. No.
09/770,861
Filed
2001-01-26
Granted
2002-12-17
Examiner
TRAN, LEN
Art Unit
1725
PTA
-10 days