Granted Patent
Utility
US 6,494,361
· Confirmation No. 7221
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE FABRICATION METHOD
Patented Case
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-05-10 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2001-01-26 | TRNA |
Transmittal of New Application | 3 | View | |
| 2001-01-26 | SPEC |
Specification | 21 | View | |
| 2001-01-26 | CLM |
Claims | 6 | View | |
| 2001-01-26 | ABST |
Abstract | 1 | View | |
| 2001-01-26 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2001-01-26 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Christopher Scanlan
Phoenix, AZ
Jon G. Aday
Gilbert, AZ
Attorneys & Agents of Record
Classification
USPC
228/223
H10W70/099
H05K3/282
B23K2101/40
H05K3/3485
H10W72/07236
Patent Term Adjustment
-10days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2020-10-09
TERMINATION & RELEASE OF PATENT SECURITY AGREEMENT
Recorded 2006-01-03
SECURITY AGREEMENT
Recorded 2004-11-02
RELEASE OF LIEN ON PATENTS
Recorded 2004-07-16
SECURITY AGREEMENT
Recorded 2004-07-06
SECURITY INTEREST
Recorded 2003-04-23
RECORD TO CORRECT THE STATE OF INCORPORATION OF THE ASSIGNEE. DOCUMENT PREVIOUSLY RECORDED AT REEL 011488 FRAME 0440. (ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE THE ENTIRE INTEREST.)
Recorded 2002-10-24
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-01-26
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