IP Library › Assignment 013974/0893
Patent Assignment
Reel/Frame 013974/0893

Security Interest

Recorded: 2003-04-23 Received: 2003-04-29 Pages: 9
Assignors
AMKOR TECHNOLOGY, INC.
Executed: 2003-04-22
GUARDIAN ASSETS, INC.
Executed: 2003-04-22
Assignee
CITICORP USA, INC. AS "COLLATERAL AGENT"
2 PENNS WAY, NEW CASTLE, DE, 19720, UNITED STATES
Covered Properties (22)
Materials and Methods for in Vitro Production of Bacteria
Application: 10/460,581 →
Materials and methods for in vitro production of pasteuria
Application: 60/388,008 →
Method and System for Providing Enhanced Caller Identfication Information Including Total Call Control for All Received Calls
Application: 10/034,851 →
Semiconductor Package Having Multiple Dies with Independently Biased Back Surfaces
Application: 09/953,422 →
Integrated Circuit Package Including Pin and Barrel Interconnects
Application: 09/932,109 →
Pre-Drilled Ball Grid Array Package
Application: 09/916,848 →
Method for Forming a Reduced Thickness Packaged Electronic Device
Application: 09/916,719 →
Method and Apparatus for Attaching Multiple Metal Components to Integrated Circuit Modules
Application: 09/884,357 →
Active Heat Sink for Cooling a Semiconductor Chip
Application: 09/866,100 →
Method of Making a Plastic Pakage for an Optical Integrated Circuit Device
Application: 09/839,861 →
Making Semiconductor Devices Having Stacked Dies with Biased Back Surfaces
Application: 09/828,396 →
Semiconductor Package with Warpage Resistant Substrate
Application: 09/812,426 →
Micromirror Device Package
Application: 09/804,749 →
Structure Including Electronic Components Singulated Using Laser Cutting
Application: 09/797,759 →
Method of Singulation Using Laser Cutting
Application: 09/797,756 →
Printed Circuit Board for Semiconductor Package and Method for Manufacturing the Same
Application: 09/783,797 →
Semiconductor Module Package Substrate
Application: 09/770,859 →
Semiconductor Module Package Substrate Fabrication Method
Application: 09/770,861 →
Materials and methods for biological control of soilborne pathogens
Application: 09/767,175 →
Method for Forming a Bond Wire Pressure Sensor Die Package
Application: 09/754,229 →
Method for Forming a Flip Chip Pressure Sensor Die Package
Application: 09/754,239 →
Bond Wire Pressure Sensor Die Package
Application: 09/754,393 →