IP Library › Granted Patent US 6,445,075
Granted Patent Utility
US 6,445,075 · Confirmation No. 7219

SEMICONDUCTOR MODULE PACKAGE SUBSTRATE

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 Code Description Pages PDF
2001-01-26 TRNA Transmittal of New Application 3 View
2001-01-26 SPEC Specification 20 View
2001-01-26 CLM Claims 6 View
2001-01-26 ABST Abstract 1 View
2001-01-26 DRW Drawings-only black and white line drawings 8 View
2001-01-26 OATH Oath or Declaration filed 3 View
2001-01-26 TRNA Transmittal of New Application 3 View
2001-01-26 SPEC Specification 20 View
2001-01-26 CLM Claims 6 View
2001-01-26 ABST Abstract 1 View
2001-01-26 DRW Drawings-only black and white line drawings 8 View
2001-01-26 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,445,075
App. No.
09/770,859
Filed
2001-01-26
Granted
2002-09-03
Art Unit
2818
PTA
-15 days