Patent Assignment
Reel/Frame 046683/0139
Security Interest
Recorded: 2018-08-01
Received: 2018-08-01
Pages: 67
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2018-07-13
Assignee
BANK OF AMERICA, N.A., AS AGENT
333 SOUTH HOPE STREET, 19TH FLOOR, LOS ANGELES, CA, 90071, UNITED STATES
Covered Properties
(100)
Semiconductor Device and Manufacturing Method Thereof
Application:
16/017,735 →
Sensor Package and Manufacturing Method Thereof
Application:
15/988,940 →
Semiconductor Device and Method of Manufacturing Semiconductor Device
Application:
15/987,075 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/973,799 →
Semiconductor Device Package and Manufacturing Method Thereof
Application:
15/973,329 →
Method and System for Packing Optimization of Semiconductor Devices
Application:
15/968,360 →
Semiconductor Package Using Cavity Substrate and Manufacturing Methods
Application:
15/953,591 →
Electronic device comprising a conductive pad on a protruding-through electrode
Application:
15/953,024 →
Semiconductor Device with Optically-Transmissive Layer and Manufacturing Method Thereof
Application:
15/947,245 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/945,938 →
Embedded Ball Land Substrate, Semiconductor Package, and Manufacturing Methods
Application:
15/943,097 →
Semiconductor Package and Manufacturing Method Thereof
Application:
15/936,877 →
Electronic Device with Adaptive Vertical Interconnect and Fabricating Method Thereof
Application:
15/937,423 →
Semiconductor Package with Multiple Compartments
Application:
15/934,267 →
Semiconductor Package Structure for Improving Die Warpage and Manufacturing Method Thereof
Application:
15/919,791 →
System and Method for Laser Assisted Bonding of Semiconductor Die
Application:
15/919,569 →
Packaged Electronic Device Having Integrated Antenna and Locking Structure
Application:
15/911,082 →
Method of Forming an Electronic Device Structure Having an Electronic Component with an on-Edge Orientation and Related Structures
Application:
15/907,039 →
Method of Manufacturing an Electronic Device and Electronic Device Manufactured Thereby
Application:
15/905,602 →
Electronic Package Structure with Improved Board Level Reliability
Application:
15/893,591 →
Method of Forming a Molded Substrate Electronic Package and Structure
Application:
15/888,003 →
Method for Fabricating Semiconductor Package and Semiconductor Package Using the Same
Application:
15/874,602 →
Wafer Level Package and Fabrication Method
Application:
15/872,397 →
Semiconductor Package and Manufacturing Method Thereof
Application:
15/871,617 →
Method of Manufacturing a Semiconductor Device
Application:
15/869,447 →
Semiconductor Package and Fabricating Method Thereof
Application:
15/854,095 →
Semiconductor Device with Integrated Heat Distribution and Manufacturing Method Thereof
Application:
15/847,242 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/847,329 →
Semiconductor Device and Method of Manufacturing a Semiconductor Device
Application:
15/841,892 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/837,917 →
Manufacturing Method of Semiconductor Device and Semiconductor Device Thereof
Application:
15/831,771 →
Semiconductor Package and Fabricating Method Thereof
Application:
15/832,027 →
Land Structure for Semiconductor Package and Method Therefor
Application:
15/823,737 →
Electronic Device Package and Fabricating Method Thereof
Application:
15/823,987 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/815,243 →
Semiconductor Device with Thin Redistribution Layers
Application:
15/812,741 →
Semiconductor Device with Redistribution Layers on Partial Encapsulation and Non-Photosensitive Passivation Layers
Application:
15/812,202 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/812,953 →
Semiconductor Package and Manufacturing Method Thereof
Application:
15/806,074 →
Heat Sink Attached to an Electronic Component in a Packaged Device
Application:
15/799,941 →
Electronic Device with Top Side Pin Array and Manufacturing Method Thereof
Application:
15/725,938 →
Semiconductor Package and Fabricating Method Thereof
Application:
15/707,646 →
Packaged Electronic Device Having Stepped Conductive Structure and Related Methods
Application:
15/706,688 →
Method of Forming a Packaged Semiconductor Device Having Enhanced Wettable Flank and Structure
Application:
15/700,101 →
Packaging for Fingerprint Sensors and Methods of Manufacture
Application:
15/695,478 →
Semiconductor Package Using A Coreless Signal Distribution Structure
Application:
15/689,714 →
Method of Manufacturing a Package-on-Package Type Semiconductor Package
Application:
15/683,065 →
Encapsulated Semiconductor Package and Method of Manufacturing Thereof
Application:
15/683,328 →
Method of Manufacturing an Electronic Device and Electronic Device Manufactured Thereby
Application:
15/673,565 →
Stackable via Package and Method
Application:
15/670,908 →
Fingerprint Sensor and Manufacturing Method Thereof
Application:
15/670,589 →
Methods and Structures for Increasing the Allowable Die Size in Tmv Packages
Application:
15/663,024 →
Wafer Level Fan Out Semiconductor Device and Manufacturing Method Thereof
Application:
15/656,654 →
Thin Bonded Interposer Package
Application:
15/650,205 →
Packaging for Fingerprint Sensors and Methods of Manufacture
Application:
15/646,973 →
Encapsulated Semiconductor Package
Application:
15/634,041 →
Method of Forming a Plurality of Electronic Component Packages
Application:
15/634,861 →
Semiconductor Device Having Emi Shielding Structure and Related Methods
Application:
15/632,335 →
Semiconductor Package Having Inspection Structure and Related Methods
Application:
15/615,769 →
Compositions and Methods for Nucleic Acid Amplification
Application:
15/597,313 →
Fingerprint Sensor and Manufacturing Method Thereof
Application:
15/591,416 →
Semiconductor Device Using Emc Wafer Support System and Fabricating Method Thereof
Application:
15/490,091 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/487,024 →
Semiconductor Device with Leadframe Configured to Facilitate Reduced Burr Formation
Application:
15/479,223 →
Method for Fabricating Semiconductor Package and Semiconductor Package Using the Same
Application:
15/477,853 →
Semiconductor Device with Thin Redistribution Layers
Application:
15/471,615 →
Stress Relieving Through-Silicon Vias
Application:
15/468,433 →
Semiconductor Device and Method of Manufacturing Thereof
Application:
15/469,008 →
Semiconductor Device with Tiered Pillar and Manufacturing Method Thereof
Application:
15/467,794 →
Semiconductor Device and Method of Manufacturing Thereof
Application:
15/465,307 →
Method of Forming a Packaged Semiconductor Device Using Ganged Conductive Connective Assembly and Structure
Application:
15/460,032 →
Semiconductor Device Including Leadframe with a Combination of Leads and Lands and Method
Application:
15/457,937 →
Semiconductor Package with Multiple Compartments
Application:
15/448,177 →
Apparatus, Method and System for Calibrating a Liquid Dispensing System
Application:
15/447,931 →
Semiconductor Device Having Stacked Dies and Stacked Pillars and Method of Manufacturing Thereof
Application:
15/445,568 →
Semiconductor Device Having an Encapsulated Front Side and Interposer and Manufacturing Method Thereof
Application:
15/429,591 →
Semiconductor Device Package and Manufacturing Method Thereof
Application:
15/413,767 →
Semiconductor Package With EMI Shield and Fabricating Method Thereof
Application:
15/404,242 →
Semiconductor Package and Fabricating Method Thereof
Application:
15/400,041 →
Embedded Die in Panel Method and Structure
Application:
15/398,845 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/397,052 →
Semiconductor Device with Through-Mold Via
Application:
15/390,568 →
Semiconductor Product with Interlocking Metal-to-Metal Bonds and Method for Manufacturing Thereof
Application:
15/387,016 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/383,923 →
Semiconductor Device and Method of Manufacturing Thereof
Application:
15/373,713 →
Semiconductor Device Having Conductive Wire with Increased Attachment Angle and Method
Application:
15/368,583 →
Semiconductor Device with Embedded Semiconductor Die and Substrate-to-Substrate Interconnects
Application:
15/357,551 →
Semiconductor Device and Method of Manufacturing Thereof
Application:
15/350,647 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/351,026 →
Stackable Package and Method
Application:
15/347,545 →
Manufacturing Method of Semiconductor Device and Semiconductor Device Thereof
Application:
15/346,507 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/340,785 →
Semiconductor Package and Manufacturing Method Thereof
Application:
15/297,365 →
Semiconductor Device Including Leadframe with a Combination of Leads and Lands and Method
Application:
15/293,524 →
Semiconductor Package and Manufacturing Method Thereof
Application:
15/289,738 →
Robust Pillar Structure for Semiconductor Device Contacts
Application:
15/285,110 →
Fine Pitch Copper Pillar Package and Method
Application:
15/284,242 →
Semiconductor Package in Package
Application:
15/261,965 →
Semiconductor Device and Manufacturing Method
Application:
15/258,001 →
Semiconductor Device and Manufacturing Method Thereof
Application:
15/256,970 →