Methods and structures for increasing the allowable die size in TMV packages
A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.
1. A package comprising:
a substrate comprising a pad;
an electronic component coupled to the substrate;
a pillar coupled to the pad, the pillar comprising a wire extending upward from the pad; and
a package body enclosing the pillar and the electronic component, wherein the package body comprises a bottom side facing the substrate and a top side facing away from the substrate,
wherein:
the wire is bent and exposed at the top side of the package body;
no portion of the wire extending from the pad runs directly horizontally; and
the wire is not connected to a top side of the electronic component.
2. The package of claim 1 , wherein at least a portion of the wire is bent within the package body.
3. The package of claim 1 , wherein the wire protrudes from the top side of the package body.
4. The package of claim 3 , wherein:
the top side of the package body comprises a principal surface facing upward; and
the wire protrudes from the principal surface.
5. The package of claim 3 , wherein at least a portion of the wire is coated with a metal.
6. The package of claim 1 , wherein:
the top side of the package body comprises a principal surface that faces upward and is at a first vertical distance from the substrate; and
the wire exits from the top side of the package body at a second vertical distance from the substrate different from the first vertical distance.
7. The package of claim 6 , wherein the second distance is less than the first distance.
8. The package of claim 1 , wherein the wire comprises a copper wire that is ball-bonded to the pad.
9. The package of claim 1 , wherein the electronic component is laterally offset from the pad.
10. A package comprising:
a substrate comprising a pad;
an electronic component coupled to the substrate;
a pillar coupled to the pad, the pillar comprising a wire extending upward from the pad; and
a package body enclosing the pillar and the electronic component, where the package body comprises a principal surface facing upward,
wherein:
the wire protrudes from the principal surface of the package body;
no portion of the wire extending from the pad runs directly horizontally; and
the wire is not connected to a top side of the electronic component.
11. The package of claim 10 , wherein the wire is bent.
12. The package of claim 11 , wherein at least a portion of the wire is coated with a metal.
13. The package of claim 10 , wherein:
the principal surface is at a first distance from the substrate; and
the wire exits from the package body at a second distance from the substrate different from the first distance.
14. The package of claim 13 , wherein the second distance is less than the first distance.
15. The package of claim 10 , wherein the wire comprises a copper wire that is ball-bonded to the pad.
16. A package comprising:
a substrate comprising a pad;
an electronic component coupled to the substrate;
a pillar coupled to the pad, the pillar comprising a wire extending from the pad;
a package body enclosing the pillar and the electronic component, where the package body comprises a bottom side facing the substrate and a top side facing away from the substrate, and the wire is exposed at the top side of the package body; and
an underfill, different from the package body, between at least a center portion of the electronic component and the substrate, wherein the underfill surrounds flip chip bumps below the electronic component but does not surround the wire.
17. The package of claim 16 , wherein the wire protrudes from the top side of the package body.
18. The package of claim 16 , wherein:
the top side of the package body comprises a principal surface at a first height from the substrate; and
the wire exits from the top side of the package body at a second height from the substrate that is different from the first height.
19. The package of claim 18 , wherein the second height is less than the first height.
20. The package of claim 16 , wherein the wire is bent.