IP Library › Assignment 043133/0480
Patent Assignment
Reel/Frame 043133/0480

Assignment of Assignor's Interest

Recorded: 2017-07-28 Pages: 7
Assignors
NICHOLLS, LOUIS W.
Executed: 2012-04-18
ST. AMAND, ROGER D.
Executed: 2012-04-18
KIM, JIN SEONG
Executed: 2012-04-19
JUNG, WOON KAB
Executed: 2012-04-19
YANG, SUNG JIN
Executed: 2012-04-17
DARVEAUX, ROBERT F.
Executed: 2012-04-18
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Methods and Structures for Increasing the Allowable Die Size in Tmv Packages
Application: 15/663,024 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →