Method of forming a packaged semiconductor device having enhanced wettable flank and structure

1. A method for forming a packaged electronic device comprising:

providing a substrate comprising:

a lead comprising:

a first terminal portion having a first thickness; and

a second terminal portion having an inward facing side surface having a second thickness that is less than the first thickness;

electrically coupling an electronic device to the lead;

providing a package body encapsulating the electronic device and portions of the lead;

removing a first portion of the first terminal portion to provide an outward facing side surface of the lead;

forming a conductive layer on the outward facing side surface of the lead; and

singulating a second portion of the first terminal portion, wherein:

providing the substrate comprises:

providing a carrier having a first major surface and a second major surface opposite to the first major surface;

providing a conductive pattern on the first major surface; and

providing a conductive pillar on a first portion of the conductive pattern but not on a second portion of the conductive pattern, wherein the conductive pillar and the first portion of the conductive pattern provide the first terminal portion and the second portion of the conductive pattern provides the second terminal portion.

2. The method of claim 1 , wherein:

providing the substrate comprises providing a pad, wherein the second terminal portion is proximate to the pad and the first terminal portion is distal to the pad;

removing the first portion of the first terminal portion comprises forming the outward facing side surface comprising an outward facing recessed side surface; and

forming the conductive layer comprises forming the conductive layer on a vertical portion and a horizontal portion of the outward facing recessed side surface.

3. The method of claim 1 , wherein:

providing the substrate comprises providing the conductive pattern with a pad;

the method further comprises attaching the electronic device to the pad; and

the method further comprises removing the carrier after forming the package body.

4. The method of claim 1 , wherein:

providing the substrate comprises providing the conductive pattern with a pad;

the method further comprises forming a molded layer covering portions of the conductive pillar, the second portion of the conductive pattern, and the pad;

the method further comprises removing the carrier before electrically coupling the electronic device to the lead to expose the conductive pattern to the outside of the molded layer; and

the method further comprises electrically coupling the electronic device to the pad.

5. The method of claim 4 , wherein electrically coupling the electronic device comprises attaching the electronic device to the lead and the pad in a flip-chip configuration.

6. The method of claim 4 , further comprising recessing surfaces of the conductive pattern below a major surface of the molded layer.

7. The method of claim 1 , wherein electrically coupling the electronic device to the lead comprises electrically connecting the electronic device using a conductive connective structure attached to the second terminal portion.

8. The method of claim 1 , wherein electrically coupling the electronic device to the lead comprises electrically connecting the electronic device using a conductive connective structure attached to the first terminal portion.

9. The method of claim 1 , wherein singulating the second portion of the first terminal portion further defines a side surface of the package body.

10. The method of claim 1 , wherein:

providing the conductive pattern comprises providing the conductive pattern having a first thickness in a range from about 3 microns through 50 microns; and

providing the conductive pillar comprises providing the conductive pillar having a second thickness in a range from about 30 microns through 300 microns.

11. A method of forming a packaged electronic device, comprising:

providing a carrier having a first major surface and a second major surface opposite to the first major surface, a conductive pattern on the first major surface, and a conductive pillar on a first portion of the conductive pattern but not on a second portion of the conductive pattern, wherein:

the conductive pillar and the first portion of conductive pattern provide a first terminal portion;

the second portion of the conductive pattern provides a second terminal portion;

the first terminal portion and the second terminal portion are configured as a lead;

the first terminal portion comprises a first thickness; and

the second terminal portion comprises an inward facing side surface having a second thickness that is less than the first thickness;

electrically coupling an electronic device to the lead;

providing a package body encapsulating the electronic device and portions of the lead;

removing a first portion of the first terminal portion to provide an outward facing side surface of the lead;

forming a conductive layer on the outward facing side surface of the lead; and

singulating a second portion of the first terminal portion.

12. The method of claim 11 , wherein:

providing the carrier comprises providing the conductive pattern comprising a pad;

the method further comprises attaching the electronic device to the pad; and

the method further comprises removing the carrier after forming the package body.

13. The method of claim 11 , wherein:

providing the carrier comprises providing the conductive pattern comprising a pad;

the method further comprises forming a molded layer covering portions of the conductive pillar, the second portion of the conductive pattern, and the pad;

the method further comprises removing the carrier before electrically coupling the electronic device to the lead, wherein removing the carrier exposes the conductive pattern to the outside of the molded layer; and

the method further comprises electrically coupling the electronic device to the pad.

14. The method of claim 13 , wherein electronically coupling the electronic device comprises attaching the electronic device to the lead and the pad in a flip-chip configuration.

15. The method of claim 11 , wherein electrically coupling the electronic device to the lead comprises electrically connecting the electronic device using a conductive connective structure attached to the first terminal portion.

16. The method of claim 11 , wherein:

removing the first portion of the first terminal portion comprises forming the outward facing side surface comprising an outward facing recessed side surface;

forming the conductive layer comprises forming the conductive layer on a vertical portion and a horizontal portion of the outward facing recessed side surface; and

singulating the second portion of the first terminal portion further defines a side surface of the package body.

17. A packaged electronic device comprising:

a substrate comprising:

a conductive pattern layer;

a conductive pillar layer disposed on a first portion of the conductive pattern layer but not on a second portion of the conductive pattern layer, wherein:

the conductive pillar layer and the first portion of conductive pattern layer provide a first terminal portion and the second portion of the conductive pattern layer provides a second terminal portion;

the first terminal portion and the second terminal portion are configured as a lead;

the first terminal portion comprises a first thickness;

the second terminal portion comprises an inward facing side surface having a second thickness that is less than the first thickness; and

the first terminal portion comprises an outward facing side surface of the lead;

an electronic device electrically coupled to the lead;

a package body encapsulating the electronic device and portions of the lead; and

a conductive layer disposed on the outward facing side surface of the lead.

18. The packaged electronic device of claim 17 , wherein:

the conductive pattern layer further comprises a pad; and

the electronic device is attached to the pad.

19. The packaged electronic device of claim 17 , wherein:

the outward facing side surface of the lead comprises an outward facing recessed side surface; and

the conductive layer is disposed on a vertical portion of the outward facing recessed side surface and is disposed on a horizontal portion of the outward facing recessed surface.

20. The packaged electronic device of claim 17 , wherein:

the conductive pattern layer further comprises a pad;

the packaged electronic device further comprises a molded layer covering portions of the conductive pillar layer, the second portion of the conductive pattern layer, and the pad;

the conductive pillar layer comprises a bottom surface exposed to the outside of the molded layer;

the conductive layer is disposed on the bottom surface of the conductive pillar layer; and

the electronic device is attached to the pad and the second terminal portion in a flip-chip configuration.