Packaged electronic device having stepped conductive structure and related methods

1. An electronic package comprising:

a substrate having a first conductive element, wherein:

the first conductive element comprises a first stepped portion disposed at a first end of the first conductive element; and

the first stepped portion comprises:

a first groove extending inward from a lower surface of the first conductive element; and

a second groove extending further inward from the first groove towards an upper surface of the first conductive element;

an electronic component coupled to the first conductive element; and

an encapsulant encapsulating the electronic component and a portion of the substrate such that the first stepped portion is exposed outside a first exterior side surface of the encapsulant,

wherein:

the first conductive element has a first width

the first groove has a second width; and

the second groove has a third width less than the second width.

2. The electronic package of claim 1 , wherein:

the substrate further comprises a second conductive element;

the second conductive element comprises a second stepped portion disposed at a first end of the second conductive element; and

the second stepped portion is exposed outside a second exterior side surface of the encapsulant.

3. The electronic package of claim 2 , wherein:

the substrate comprises a lead frame;

the first conductive element comprises a lead;

the second conductive element comprises a die pad;

the electronic component is attached to the die pad; and

the electronic component is electrically connected to the lead with a conductive clip.

4. The electronic package of claim 3 , wherein:

the lead comprises:

a first connecting portion disposed to be connected to the electronic component;

a second connecting portion having the first stepped portion; and

a third connecting portion configured to connect the first connecting portion to the second connecting portion; and

the first connecting portion resides on a different plane than the die pad.

5. The electronic package of claim 1 , wherein:

the first groove has a first vertical face disposed at a first horizontal length inward from the first end of the first conductive element;

the second groove has a second vertical face disposed at second horizontal length inward from the first end of the first conductive element;

the first horizontal length is greater than the second horizontal length; and

the first exterior side surface of the encapsulant does not laterally overlap the first vertical face in a cross-sectional view.

6. The electronic package of claim 1 , wherein the first stepped portion further comprises a third groove extending further inward from the second groove toward the upper surface of the first conductive element.

7. The electronic package of claim 1 , wherein:

the first width is greater than the second width.

8. The electronic package of 1 , wherein:

the substrate further comprises a second conductive element comprising a die pad;

the die pad comprises a second stepped portion disposed at a first end of the die pad;

the second stepped portion is exposed outside a second exterior side surface of the encapsulant; and

the first conductive element comprises a lead.

9. The electronic package of claim 1 further comprising:

a second substrate having pad, wherein:

the electronic package is attached to the substrate;

the first stepped portion is attached to the pad with a conductive material; and

the conductive material covers the first stepped portion.

10. A semiconductor package comprising:

a lead frame including a die pad and a lead;

a semiconductor device electrically coupled to the lead; and

an encapsulant encapsulating the semiconductor die and portions of the lead frame,

wherein:

a first stepped portion comprising a first groove and a second groove is disposed at a first end of the lead;

the first stepped portion is exposed outside a first exterior side surface of the encapsulant;

a second stepped portion comprising at least two grooves disposed at an end of the die pad; and

the second stepped portion is exposed outside a second exterior side surface of the encapsulant.

11. The semiconductor package of claim 10 , wherein:

the semiconductor device is electrically coupled to the lead with a conductive clip.

12. The semiconductor package of claim 10 , wherein:

the lead has a first width;

the first groove has a second width less than the first width;

the second groove has a third width; and

the third width is less than the second width.

13. The semiconductor package of claim 10 , wherein:

the first groove has a first vertical face disposed at a first horizontal length extending inward from the first end;

the second groove has a second vertical face disposed at second horizontal length extending inward from the first end; and

the first horizontal length is greater than the second horizontal length.

14. The semiconductor package of claim 13 , wherein the first exterior side surface of the encapsulant does not laterally overlap the first vertical face in a cross-sectional view.

15. The semiconductor package of claim 10 , wherein the first end is disposed as part of the die pad.

16. The semiconductor package of claim 10 , wherein:

the first groove extends inward from a lower surface of the lead frame; and

the second groove extends further inward from the first groove towards an upper surface of the lead frame.

17. A method of forming an electronic package comprising:

providing a substrate having a first conductive element, wherein:

the first conductive element comprises a first stepped portion disposed at a first end of the first conductive element, the first conductive element having a first width; and

the first stepped portion comprises:

a first groove extending inward from a lower surface of the first conductive element, the first groove having a second width; and

a second groove extending further inward from the first groove towards an upper surface of the first conductive element, the second groove having a third width less than the second width;

coupling an electronic component to the first conductive element; and

providing an encapsulant encapsulating the electronic component and a portion of the substrate such that the first stepped portion is exposed outside a first exterior side surface of the encapsulant.

18. The method of claim 17 , wherein:

providing the substrate comprises providing a lead frame;

providing the substrate further comprises providing a die pad comprising a second stepped portion disposed at a first end of the die pad;

providing the first conductive element comprises providing a lead;

coupling the electronic component comprises electrically connecting the electronic device to the lead using a conductive clip; and

providing the encapsulant comprises providing the encapsulant such that the second stepped portion is exposed outside of a second exterior side surface of the encapsulant.

19. The method of claim 17 , wherein:

providing the substrate comprises:

providing the first groove having a first vertical face disposed at a first horizontal length inward from the first end of the first conductive element;

providing the second groove having a second vertical face disposed at second horizontal length inward from the first end of the first conductive element; and

providing the first horizontal length greater than the second horizontal length; and

providing the encapsulant comprises providing the first exterior side surface of the encapsulant such that the first exterior side surface does not laterally overlap the first vertical face in a cross-sectional view.

20. The method of claim 17 , wherein:

providing the substrate comprises:

providing the first width greater than the second width.