IP Library › Assignment 043869/0973
Patent Assignment
Reel/Frame 043869/0973

Assignment of Assignor's Interest

Recorded: 2017-09-16 Pages: 3
Assignors
KIM, BYONG JIN
Executed: 2017-09-15
TING, JIA YUNN
Executed: 2017-09-15
JEON, HYEONG IL
Executed: 2017-09-15
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Packaged Electronic Device Having Stepped Conductive Structure and Related Methods
Application: 15/706,688 →
Publication: US 2019/0088574
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →