Electronic device with top side pin array and manufacturing method thereof
View Patent ↗An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
1. A method of manufacturing an electronic device, the method comprising:
receiving a substrate that comprises a plurality of pads and a plurality of solder members, each solder member of the plurality of solder members positioned on a respective pad of the plurality of pads;
positioning a pin template comprising a plurality of apertures above the substrate such that each aperture of the plurality of apertures aligns with a respective pad of the plurality of pads;
placing a plurality of pins on an upper surface of the pin template;
moving the plurality of pins with respect to the upper surface of the pin template such that each pin of the plurality of pins falls into a respective aperture of the plurality of apertures;
lifting the pin template away from the substrate and the plurality of pins; and
attaching the plurality of pins to the plurality of pads by reflowing the plurality of solder members.
2. The method of claim 1 , further comprising removing a temporary carrier from a signal distribution structure of the substrate.
3. The method of claim 2 , further comprising mounting a semiconductor die to the signal distribution structure.
4. The method of claim 1 , wherein said moving the the plurality of pins comprises vibrating the pin template.
5. The method of claim 1 , wherein said positioning the pin template above the substrate is performed before said placing the plurality of pins.
6. The method of claim 1 , wherein each pin of the plurality of pins is cylinder-shaped.
7. The method of claim 6 , wherein each pin of the plurality of pins comprises a curved transition between an end surface and a side surface.
8. The method of claim 1 , wherein:
each aperture of the plurality of apertures has an aperture diameter; and
each pin of the plurality of pins comprises a cylinder-shaped main body having a body diameter that is less than the aperture diameter, and a head having a head diameter that is greater than the aperture diameter.
9. The method of claim 1 , further comprising:
holding each pin of the plurality of pins in the respective aperture of the plurality of apertures with an adhesive tape; and
removing the adhesive tape after said positioning the pin template above the substrate.
10. The method of claim 1 , wherein after said reflowing the solder members, each reflowed solder member comprises a portion that lies between its respective pad and its respective pin.
11. The method of claim 1 , further comprising:
coupling a semiconductor die to the substrate and positioned laterally between at least two pins of the plurality of pins; and
encapsulating the semiconductor die and the plurality of pins in an encapsulating material.
12. A method of manufacturing an electronic device, the method comprising:
receiving a substrate that comprises a plurality of pads;
placing a plurality of pins on a pin template comprising a plurality of apertures;
moving each pin of the plurality of pins such that each pin falls into a respective aperture of the plurality of apertures;
aligning the plurality of apertures with a respective pad of the plurality of pads; and
attaching each pin of the plurality of pins to its respective pad.
13. The method of claim 12 , wherein each pad of the plurality of pads has a respective solder member thereon prior to said aligning.
14. The method of claim 12 , wherein said aligning comprises positioning the pin template above the substrate prior to said moving each pin of the plurality of pins.
15. The method of claim 14 , further comprising holding each pin of the plurality of pins in its respective aperture prior to said positioning the pin template above the substrate.
16. The method of claim 12 , wherein after said attaching, a layer of solder lies between each pin of the plurality of pins and its respective pad.
17. A method of manufacturing an electronic device, the method comprising:
providing a pin template comprising a plurality of apertures;
positioning the pin template above a substrate such that the plurality of apertures align with a plurality of pads of the substrate;
moving a plurality of pins in relation to the pin template such that each pin of the plurality of pins is positioned in a respective aperture of the plurality of apertures and aligned with a respective pad of the plurality of pads; and
soldering each pin of the plurality of pins to said respective pad of the substrate.
18. The method of claim 17 , further comprising removing a temporary carrier from a signal distribution structure of the substrate after said soldering.
19. The method of claim 18 , further comprising mounting a semiconductor die that comprises active semiconductor circuitry to the signal distribution structure.