Semiconductor package and manufacturing method thereof

1. A method of manufacture comprising:

providing a substrate comprising:

a substrate top surface having a substrate top first pad and a substrate top second pad,

a substrate bottom surface having a substrate bottom. first pad and a substrate bottom second pad, and

a substrate lateral surface;

attaching a first electronic device to the substrate top surface, the first electronic device coupled to the substrate top first pad and comprising:

a first device first surface facing the substrate top surface,

a first device lateral surface, and

a first device second surface facing away from the substrate top surface;

coupling a first passive component to the substrate top second pad;

applying a first encapsulant to encapsulate the substrate top surface, the first passive component, and the first electronic device, the first encapsulant having:

a first encapsulant top surface, and

a first encapsulant lateral surface;

attaching a second electronic device to the substrate bottom surface, the second electronic device coupled to the substrate bottom first pad and comprising:

a second device first surface facing the substrate bottom side,

a second device lateral surface, and

a second device second surface facing away from the substrate bottom surface;

providing a first external interconnect coupled to the substrate bottom second pad;

applying a second encapsulant to encapsulate the substrate bottom surface and the second electronic device, the second encapsulant comprising:

a second encapsulant lateral surface;

and

applying a first electromagnetic interference (EMI) shield as a layer that bounds at least:

the first encapsulant top surface,

the first encapsulant lateral surface, and

the substrate lateral surface,

wherein the first EMI shield is spaced apart from the external interconnect.

2. The method of claim 1 , wherein:

the second encapsulant contacts the second device first surface and a portion of the second device lateral surface;

the second device second surface is exposed from the second encapsulant; and

the second encapsulant is spaced apart from the external interconnect.

3. The method of claim 1 , wherein:

the EMI shield covers the substrate lateral surface such that no more than an exposed height of 0 to 50 μm is exposed from the first EMI shield,

the exposed height measured vertically from the substrate bottom surface and along the substrate lateral surface.

4. The method of claim 1 , wherein:

the first encapsulant comprises a first layer of a mold material; and

the second encapsulant comprises a second layer of the mold material.

5. The method of claim 1 , wherein:

the second encapsulant comprises a second encapsulant bottom surface;

the external interconnect comprises:

an encapsulated section bounded by and in contact with the second encapsulant;

an exposed section bounded by but detached from the second encapsulant; and

a protruded section protruding further than the second encapsulant bottom surface.

6. The method of claim 1 , wherein:

the first EMI shield comprises a continuous conformal coating that conforms to respective contours of the first encapsulant top surface, the first encapsulant lateral surface, the substrate lateral surface, and the second encapsulant lateral surface.

7. The method of claim 1 , wherein:

the second encapsulant comprises a second encapsulant bottom surface;

the first EMI shield covers the second encapsulant lateral surface such that no more than an exposed height of 0 to 50 μm is exposed from the first EMI shield,

the exposed height measured vertically from the second encapsulant bottom surface and along the second encapsulant lateral surface.

8. The method of claim 1 , comprising:

coupling a third electronic device to the substrate top surface;

coupling a fourth electronic device to the substrate bottom surface;

coupling a second passive component to the substrate top surface; and

providing a second external interconnect coupled to the substrate bottom surface;

wherein:

a first unit portion comprises a portion of the substrate to which the first electronic device, the second electronic device, the first passive component, and the first external interconnect are coupled;

a second unit portion is adjacent to the first unit portion and comprises a portion of the substrate to which the third electronic device, the fourth electronic device, the second passive component, and the second external interconnect are coupled; and

the first encapsulant comprises a single layer that encapsulates the first electronic device, the third electronic device, the first passive component, the second passive component, and the substrate top surface across the first unit portion and the second unit portion.

9. The method of claim 8 , comprising:

attaching a primary tape across the first unit portion and the second unit portion, the primary tape comprising a primary adhesive and having:

a first tape portion adhered under the first unit portion, and

a second tape portion adhered under the second unit portion;

and

singulating through the first encapsulant, the substrate, and the primary tape to separate the first unit portion with the first tape portion from the second unit portion with the second tape portion;

wherein, after the singulating:

the primary adhesive of the first tape portion remains sealed to an edge of the first unit portion; and

the primary adhesive of the second tape portion remains sealed to an edge of the second unit portion.

10. The method of claim 9 , comprising:

attaching the first tape portion and the second tape portion to a secondary adhesive of a secondary tape, wherein the secondary adhesive is stronger than the primary adhesive;

then applying an EMI shield layer as a continuous coating comprising:

the first shield covering the first unit portion,

a second EMI shield covering the second unit portion, and

a remainder EMI shield covering a sidewall of the first tape portion, a sidewall of the second tape portion, and the secondary tape,

removing the first unit portion from the first tape portion, thereby rupturing the first EMI shield from the remainder EMI shield along an interface with the primary adhesive of the first tape portion; and

removing the second unit portion from the second tape portion, thereby rupturing the second EMI shield from the remainder EMI shield along an interface with the primary adhesive of the second tape portion.

11. The method of claim 1 , wherein:

the first external interconnect comprises a first interconnect height measured from the substrate bottom surface; and

applying the second encapsulant comprises:

applying a maximum thickness of the second encapsulant, measured from the substrate bottom surface, to remain less than the first interconnect height.

12. The method of claim 1 , comprising:

attaching a primary tape comprising a primary adhesive such that:

the primary adhesive is sealed to the substrate bottom surface; and

the second electronic device and the first external interconnect are fully embedded within the primary adhesive;

attaching the primary tape to a secondary tape comprising a secondary adhesive;

applying an EMI shield layer as a continuous coating comprising:

the first EMI shield covering

the first encapsulant top surface,

the first encapsulant lateral surface, and

the substrate lateral surface,

and

a remainder EMI shield covering

a sidewall of the first tape, and

the secondary tape;

and

removing the first tape with the secondary adhesive of the second tape, thereby

revealing the substrate bottom surface, the second electronic device, and the first external interconnect; and

rupturing the first EMI shield from the remainder EMI shield along an interface with the primary adhesive of the first tape portion.

13. The method of claim 1 , wherein:

the first external interconnect comprises

an interconnect inner portion proximate the substrate, and

an interconnect distal portion distal the substrate;

and comprising:

applying a film under the substrate bottom surface,

the film covering the interconnect distal portion;

applying the second encapsulant between the film and the substrate bottom surface, the second encapsulant encapsulating the second electronic device and the interconnect inner portion, leaving the interconnect distal portion protruded from the second encapsulant;

attaching a primary tape comprising a primary adhesive such that:

the primary adhesive is sealed to the second encapsulant and the interconnect distal portion;

attaching the primary tape to a secondary tape comprising a secondary adhesive;

then applying an EMI shield layer as a continuous coating comprising:

the first EMI shield covering

the first encapsulant top surface,

the first encapsulant lateral surface,

the substrate lateral surface, and

the second encapsulant lateral surface,

and

a remainder EMI shield covering

a sidewall of the first tape, and

the secondary tape;

and

removing the first tape with the secondary adhesive of the second tape, thereby revealing the second encapsulant and the interconnect distal portion; and

rupturing the first EMI shield from the remainder EMI shield along an interface with the primary adhesive of the first tape portion.

14. The method of claim 13 , wherein:

applying the film comprises covering the second device second surface; and

applying the second encapsulant comprises leaving the second device second surface exposed from the second encapsulant.

15. The method of claim 1 , wherein:

applying the second encapsulant comprises:

fully encapsulating the second device and the first external interconnect with the second encapsulant, and

removing a portion of the second encapsulant to partially expose an interconnect exposed section of the first external interconnect;

and comprising:

coupling an interconnect distal portion to the interconnect exposed section, the interconnect distal portion protruded further than the second encapsulant;

attaching a primary tape comprising a primary adhesive such that:

the primary adhesive is sealed to the second encapsulant and the interconnect distal portion;

attaching the primary tape to a secondary tape comprising a secondary adhesive then applying an EMI shield layer as a continuous coating comprising:

the first EMI shield covering

the first encapsulant top surface,

the first encapsulant lateral surface,

the substrate lateral surface, and

the second encapsulant lateral surface, and

a remainder EMI shield covering

a sidewall of the first tape, and

the secondary tape;

and

removing the first tape with the secondary adhesive of the second tape, thereby revealing the second encapsulant and the interconnect distal portion; and

rupturing the first EMI shield from the remainder EMI shield along an interface with the primary adhesive of the first tape portion.

16. The method of claim 15 , wherein:

removing the portion of the second encapsulant comprises:

planarizing the second encapsulant until the interconnect exposed section is exposed and coplanar with the second encapsulant.

17. The method of claim 15 , wherein:

removing the portion of the second encapsulant comprises:

forming a through-via into the second encapsulant to expose the interconnect exposed section;

and

the interconnect exposed section is depressed within the via.

18. A method of manufacture comprising:

providing a substrate comprising:

a substrate top surface having a substrate top first pad and a substrate top second pad,

a substrate bottom surface having a substrate bottom first pad and a substrate bottom second pad, and

a substrate lateral surface,

attaching a first electronic device to the substrate top surface. the first electronic device coupled to the substrate top first pad and comprising:

a first device first surface facing the substrate top surface,

a first device lateral surface, and

a first device second surface facing away from the substrate top surface;

coupling a first passive component to the substrate top second pad;

applying a first encapsulant to encapsulate the substrate top surface, the first passive component, and the first electronic device, the first encapsulant having:

a first encapsulant top surface; and

first encapsulant lateral surface;

attaching a second electronic device to the substrate bottom surface, the second electronic device coupled to the substrate bottom first pad and comprising:

a second device first surface facing the substrate bottom side,

a second device lateral surface, and

a second device second surface facing away from the substrate bottom surface;

providing a first external interconnect coupled to the substrate bottom second pad;

applying a second encapsulant to encapsulate the substrate bottom surface and the second electronic device, the second encapsulant comprising:

a second encapsulant lateral surface;

and

applying an electromagnetic interference (EMI) shield surrounding a perimeter of the second device, in contact with the second encapsulant, and exclusive of sheet metal.

19. The method of claim 18 , wherein:

the EMI shield comprises a plurality of vertical posts surrounding perimeter of the second device, extending from the substrate bottom surface and protruding from the second encapsulant.

20. A semiconductor package comprising:

a substrate having

a substrate top surface having a substrate top first pad and a substrate top second pad,

a substrate bottom surface having a substrate bottom first pad and a substrate bottom second pad, and

a substrate lateral surface;

a first electronic device on the substrate top surface and coupled to the substrate top first pad, the first electronic device comprising:

a first device first surface facing the substrate top surface,

a first device lateral surface, and

a first device second surface facing away from the substrate top surface;

a first passive component coupled to the substrate top second pad;

a first encapsulant that encapsulates the substrate top surface, the passive component, and the first electronic device, the first encapsulant having

a first encapsulant top surface, and

a first encapsulant lateral surface;

a second electronic device on the substrate bottom surface and coupled to the substrate bottom first pad, the second electronic device comprising:

a second device first surface facing the substrate bottom surface,

a second device lateral surface, and

second device second surface facing away from the substrate bottom surface;

a first external interconnect coupled to the substrate bottom second pad and comprising a first external interconnect height;

a second encapsulant that encapsulates the substrate bottom surface and the second electronic device,

the second encapsulant comprising:

a second encapsulant lateral surface, and

a second encapsulant height,

where the first external interconnect height protrudes further than the second encapsulant height;

and

a first electromagnetic interference (EMI) shield that bounds at least:

the first encapsulant top surface,

the first encapsulant lateral surface, and

the substrate lateral surface,

wherein the first EMI shield is spaced apart from the external interconnect.