Semiconductor device and manufacturing method thereof
View Patent ↗Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an interposer including a redistribution layer and a dielectric layer on a dummy substrate, connecting a semiconductor die to the redistribution layer facing an upper portion of the interposer, encapsulating the semiconductor die by using an encapsulation, removing the dummy substrate from the interposer, and connecting a bump to the redistribution layer facing a lower portion of the interposer.
1. A method of manufacturing a semiconductor device, the method comprising:
receiving a structure on a temporary substrate, the structure comprising:
an interposer comprising:
a conductive layer; and
a dielectric layer;
a semiconductor die coupled to a first side of the interposer, the semiconductor die comprising a plurality of conductive bumps; and
an encapsulating material that covers a first side of the semiconductor die, covers the first side of the interposer, and laterally surrounds the semiconductor die;
thinning the encapsulant; and
coupling a plurality of conductive interconnection structures to a second side of the interposer.
2. The method of claim 1 , wherein said thinning the encapsulant comprises thinning the encapsulant to expose the first side of the semiconductor die.
3. The method of claim 2 , wherein the conductive bumps of the semiconductor die are positioned on a second side of the semiconductor die.
4. The method of claim 1 , wherein each of the conductive bumps of the semiconductor die comprises a copper pillar.
5. The method of claim 1 , wherein said coupling the plurality of conductive interconnection structures comprises coupling the plurality of conductive interconnection structures to under bump metallization on the second side of the interposer.
6. The method of claim 5 , comprising forming the under bump metallization after said receiving the structure.
7. The method of claim 1 , wherein said thinning is performed before said coupling the plurality of conductive interconnection structures.
8. The method of claim 1 , wherein the received structure comprises adhesive material between the semiconductor die and the interposer.
9. A method of manufacturing a semiconductor device, the method comprising:
receiving a structure on a temporary substrate, the structure comprising:
an interposer comprising:
a conductive layer; and
a dielectric layer;
a semiconductor die coupled to a first side of the interposer, the semiconductor die comprising a plurality of conductive bumps at a first side of the semiconductor die, each of the plurality of conductive bumps connected to a respective part of the conductive layer of the interposer; and
an encapsulating material that laterally surrounds the semiconductor die and covers the first side of the interposer, wherein at least a second side of the semiconductor die is completely exposed from the encapsulating material; and
coupling a plurality of conductive interconnection structures to a second side of the interposer.
10. The method of claim 9 , where said coupling the plurality of conductive interconnection structures to the second side of the interposer comprises coupling each of the plurality of conductive interconnection structures to a respective under bump metallization on the second side of the interposer.
11. The method of claim 10 , comprising forming the respective under bump metallizations after said receiving the structure.
12. The method of claim 9 , wherein each of the plurality of conductive bumps of the semiconductor die is soldered to its respective part of the conductive layer of the interposer.
13. The method of claim 9 , wherein the received structure comprises adhesive material between the semiconductor die and the interposer.
14. The method of claim 13 , wherein the adhesive material is distinct from the encapsulating material.
15. A method of manufacturing a semiconductor device, the method comprising:
receiving a structure on a temporary substrate, the structure comprising:
an interposer comprising:
a conductive layer; and
a dielectric layer;
a semiconductor die coupled to a first side of the interposer, the semiconductor die comprising a plurality of conductive bumps; and
an encapsulating material that covers a first side of the semiconductor die, covers the first side of the interposer, and laterally surrounds the semiconductor die;
exposing a side of the semiconductor die; and
covering the exposed side of the semiconductor die with a second component comprising at least one conductive layer.
16. The method of claim 15 , wherein said covering comprises forming an adhesive layer between the semiconductor die and the second component.
17. The method of claim 15 , wherein said covering comprises conductively coupling the exposed side of the semiconductor die and the second component.
18. The method of claim 15 , comprising coupling a third component to a second side of the interposer, and conductively coupling the second component to the third component.
19. The method of claim 15 , wherein said exposing the side of the semiconductor die comprises thinning the encapsulating material.
20. The method of claim 15 , wherein the conductive bumps of the semiconductor die are on a side of the semiconductor die opposite the exposed side.