IP Library Granted Patent US 6,420,201
Granted Patent Utility
US 6,420,201 · Confirmation No. 2608

METHOD FOR FORMING A BOND WIRE PRESSURE SENSOR DIE PACKAGE

Inventor: Steven Webster
Patented Case View Patent ↗
⬇ PDF
Code Description Pages PDF
2001-01-03 TRNA Transmittal of New Application 3 View
2001-01-03 SPEC Specification 25 View
2001-01-03 CLM Claims 10 View
2001-01-03 ABST Abstract 1 View
2001-01-03 DRW Drawings-only black and white line drawings 26 View
2001-01-03 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,420,201
App. No.
09/754,229
Filed
2001-01-03
Granted
2002-07-16
Art Unit
2812
PTA
-79 days