IP Library Granted Patent US 6,509,637
Granted Patent Utility
US 6,509,637 · Confirmation No. 5830

LOW PROFILE MOUNTING OF THICK INTEGRATED CIRCUIT PACKAGES WITHIN LOW-PROFILE CIRCUIT MODULES

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Code Description Pages PDF
2002-03-08 TRNA Transmittal of New Application 4 View
2002-03-08 SPEC Specification 8 View
2002-03-08 CLM Claims 7 View
2002-03-08 ABST Abstract 1 View
2002-03-08 DRW Drawings-only black and white line drawings 2 View
2002-03-08 OATH Oath or Declaration filed 2 View
2002-03-08 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,509,637
App. No.
10/094,731
Filed
2002-03-08
Granted
2003-01-21
Art Unit
2815
PTA
0 days