IP Library › Granted Patent US 6,605,865
Granted Patent Utility
US 6,605,865 · Confirmation No. 6870

SEMICONDUCTOR PACKAGE WITH OPTIMIZED LEADFRAME BONDING STRENGTH

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 Code Description Pages PDF
2012-12-05 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-12-05 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-11-12 PA.. Power of Attorney 2 View
2012-11-12 N417 Electronic Filing System Acknowledgment Receipt 2 View
2001-10-19 TRNA Transmittal of New Application 3 View
2001-10-19 ADS Application Data Sheet 2 View
2001-10-19 SPEC Specification 18 View
2001-10-19 CLM Claims 6 View
2001-10-19 ABST Abstract 1 View
2001-10-19 DRW Drawings-only black and white line drawings 14 View
2001-10-19 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,605,865
App. No.
09/998,844
Filed
2001-10-19
Granted
2003-08-12
Pub. No.
US20020130400A1
Art Unit
2826
PTA
-5 days