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App. No. 10/376,988 · Confirmation No. 3913

SEMICONDUCTOR PACKAGE CAPABLE OF DIE STACKING

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗
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2003-06-24 IDS Information Disclosure Statement (IDS) Form (SB08) 24 View
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Quick Facts
App. No.
10/376,988
Filed
2003-02-28
Granted
2004-06-15
Examiner
PHAM, HOAI V
Art Unit
2814
PTA
-34 days