Patent Assignment
Reel/Frame 015320/0005
Security Agreement
Recorded: 2004-11-02
Received: 2004-11-02
Pages: 10
Assignee
CITICORP NORTH AMERICA, INC. AS AGENT
GOSHEN CORPORATE PARK, 1345 ENTERPRISE DRIVE, WEST CHESTER, PA, 19380, UNITED STATES
Covered Properties
(36)
Leadframe Package for Semiconductor Devices
Application:
10/387,801 →
Semiconductor Package Capable of Die Stacking
Application:
10/376,988 →
Method of Making a Semiconductor Package Having Exposed Metal Strap
Application:
10/356,046 →
Mounting for a Package Containing a Chip
Application:
10/340,256 →
Pre-Molded Leadframe
Application:
10/329,620 →
Semiconductor Package and Method for Fabricating the Same
Application:
10/306,627 →
Image Sensor Package
Application:
10/286,589 →
Semiconductor Device Including Metal Strap Electrically Coupled Between Semiconductor Die and Metal Leadframe
Application:
10/256,905 →
Lead-Frame Method and Circuit Module Assembly Including Edge Stiffener
Application:
10/251,410 →
Integrated Circuit Having Multiple Power/Ground Connections to a Single External Terminal and Method Therefor
Application:
10/223,749 →
Apparatus for Electrical Testing of a Substrate Having a Plurality of Terminals
Application:
10/171,211 →
Injection Molded Lens-Barrel Assembly and Method for Fabricating Lens-Barrel and Mount Assemblies
Application:
10/161,963 →
Shield Cap and Semiconductor Package Including Shield Cap
Application:
10/121,215 →
Carrier Frame and Semiconductor Package Including Carrier Frame
Application:
10/115,218 →
Semiconductor Package and Method for Manufacturing the Same
Application:
10/103,048 →
Enhanced Chip Scale Package for Wire Bond Dies
Application:
10/078,718 →
Thin Integrated Circuit Package Having an Optically Transparent Window
Application:
10/067,068 →
Semiconductor Package Including Rings Structure Connected to Leads with Vertically Downset Inner Ends
Application:
10/054,124 →
Optical Device Packages Having Improved Conductor Efficiency, Optical Coupling and Thermal Transfer
Application:
10/046,995 →
Lead Frame for Semiconductor Package
Application:
10/013,160 →
Structures for Improving Heat Dissipation in Stacked Semiconductor Packages
Application:
10/013,396 →
Multi-Layer Lead Frame Structure
Application:
09/996,226 →
Method of Making an Integrated Circuit Package
Application:
10/007,337 →
Quick Sealing Glass-Lidded Package Fabrication Method
Application:
09/946,861 →
Solderable Injection-Molded Integrated Circuit Substrate and Method Therefor
Application:
09/931,144 →
Method of Fabricating and Using an Image Sensor Package with Reflector
Application:
09/906,868 →
Image Sensor Package with Reflector
Application:
09/906,992 →
Pre-Drilled Image Sensor Package Fabrication Method
Application:
09/896,074 →
Method for Forming an Image Sensor Package with Vision Die in Lens Housing
Application:
09/896,014 →
Multi-Chip Semiconductor Package with Integral Shield and Antenna
Application:
09/855,244 →
Shielded Semiconductor Package with Single-Sided Substrate and Method for Making the Same
Application:
09/848,932 →
Stackable Lead Frame Package Using Exposed Internal Lead Traces
Application:
09/829,341 →
Making Two Lead Surface Mounting High Power Microleadframe Semiconductor Packages
Application:
09/827,791 →
Semiconductor Package Including Stacked Chips with Aligned Input/Output Pads
Application:
09/816,599 →
Semiconductor Package Having Semiconductor Chip Within Central Aperture of Substrate
Application:
09/774,952 →
Optical Module with Lens Integral Holder
Application:
09/764,165 →