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App. No. 09/774,952 · Confirmation No. 5760

SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL APERTURE OF SUBSTRATE

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2004-03-11 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-03-11 A.NA Amendment after Notice of Allowance (Rule 312) 1 View
2004-03-11 CLM Claims 4 View
2004-03-11 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2004-03-11 LET. Miscellaneous Incoming Letter 1 View
2004-03-11 DRW Drawings-only black and white line drawings 16 View
2001-01-30 TRNA Transmittal of New Application 2 View
2001-01-30 A.PE Preliminary Amendment 2 View
2001-01-30 SPEC Specification 25 View
2001-01-30 CLM Claims 11 View
2001-01-30 ABST Abstract 1 View
2001-01-30 DRW Drawings-only black and white line drawings 15 View
2001-01-30 OATH Oath or Declaration filed 6 View
2001-01-30 TRNA Transmittal of New Application 2 View
2001-01-30 A.PE Preliminary Amendment 2 View
2001-01-30 SPEC Specification 25 View
2001-01-30 CLM Claims 11 View
2001-01-30 ABST Abstract 1 View
2001-01-30 DRW Drawings-only black and white line drawings 15 View
2001-01-30 OATH Oath or Declaration filed 6 View
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Quick Facts
App. No.
09/774,952
Filed
2001-01-30
Granted
2004-07-13
Pub. No.
US20010005601A1
Art Unit
2825
PTA
-199 days