IP Library › Granted Patent US 6,737,750
Granted Patent Utility
US 6,737,750 · Confirmation No. 1608

STRUCTURES FOR IMPROVING HEAT DISSIPATION IN STACKED SEMICONDUCTOR PACKAGES

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2004-01-26 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-01-26 OATH Oath or Declaration filed 2 View
2004-01-26 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2004-01-26 LET. Miscellaneous Incoming Letter 1 View
2004-01-26 DRW Drawings-only black and white line drawings 10 View
2001-12-07 TRNA Transmittal of New Application 2 View
2001-12-07 SPEC Specification 20 View
2001-12-07 CLM Claims 5 View
2001-12-07 ABST Abstract 1 View
2001-12-07 DRW Drawings-only black and white line drawings 12 View
2001-12-07 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,737,750
App. No.
10/013,396
Filed
2001-12-07
Granted
2004-05-18
Art Unit
2811
PTA
-118 days