IP Library Granted Patent US 6,593,545
Granted Patent Utility
US 6,593,545 · Confirmation No. 9662

LASER DEFINED PADS FOR FLIP CHIP ON LEADFRAME PACKAGE FABRICATION METHOD

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Code Description Pages PDF
2001-08-13 TRNA Transmittal of New Application 3 View
2001-08-13 SPEC Specification 21 View
2001-08-13 CLM Claims 3 View
2001-08-13 ABST Abstract 1 View
2001-08-13 DRW Drawings-only black and white line drawings 9 View
2001-08-13 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,593,545
App. No.
09/929,428
Filed
2001-08-13
Granted
2003-07-15
Art Unit
1725
PTA
-93 days