IP Library Granted Patent US 6,632,997
Granted Patent Utility
US 6,632,997 · Confirmation No. 5388

PERSONALIZED CIRCUIT MODULE PACKAGE AND METHOD FOR PACKAGING CIRCUIT MODULES

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Code Description Pages PDF
2001-06-13 TRNA Transmittal of New Application 3 View
2001-06-13 SPEC Specification 10 View
2001-06-13 CLM Claims 5 View
2001-06-13 ABST Abstract 1 View
2001-06-13 DRW Drawings-only black and white line drawings 5 View
2001-06-13 OATH Oath or Declaration filed 2 View
2001-06-13 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,632,997
App. No.
09/880,277
Filed
2001-06-13
Granted
2003-10-14
Pub. No.
US20030000722A1
Art Unit
2831
PTA
-4 days