Patent Assignment
Reel/Frame 011902/0415
Assignment of Assignor's Interest
Recorded: 2001-06-13
Pages: 4
Assignee
AMKOR TECHNOLOGY
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Personalized Circuit Module Package and Method for Packaging Circuit Modules
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Re-Record to Correct the Receiving Party's Name, Previously Recorded at Reel 011902, Frame 0415.
Apr 8, 2002
From: HOFFMAN, PAUL ROBERT; MIRANDA, JOHN ARMANDO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 013113/0206 →
Assignment of Assignor's Interest
Jun 14, 2002
From: HOFFMAN, PAUL ROBERT; MIRANDA, JOHN ARMANDO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 012978/0548 →
Security Agreement
Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →
Security Agreement
Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Termination & Release of Patent Security Agreement
Jan 3, 2006
From: CITICORP NORTH AMERICA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 017388/0868 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →