IP Library Granted Patent US 6,507,102
Granted Patent Utility
US 6,507,102 · Confirmation No. 1860

PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE

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Code Description Pages PDF
2001-12-05 TRNA Transmittal of New Application 3 View
2001-12-05 A.PE Preliminary Amendment 9 View
2001-12-05 SPEC Specification 16 View
2001-12-05 CLM Claims 6 View
2001-12-05 ABST Abstract 1 View
2001-12-05 DRW Drawings-only black and white line drawings 2 View
2001-12-05 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,507,102
App. No.
10/006,642
Filed
2001-12-05
Granted
2003-01-14
Pub. No.
US20020043402A1
Art Unit
2824
PTA
-58 days