Granted Patent
Utility
US 6,603,072
· Confirmation No. 5764
MAKING LEADFRAME SEMICONDUCTOR PACKAGES WITH STACKED DIES AND INTERCONNECTING INTERPOSER
Patented Case
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-04-06 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-04-06 | SPEC |
Specification | 11 | View | |
| 2001-04-06 | CLM |
Claims | 5 | View | |
| 2001-04-06 | ABST |
Abstract | 1 | View | |
| 2001-04-06 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2001-04-06 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Donald C. Foster
Mesa, AZ
David A. Zoba
Chandler, AZ
Attorneys & Agents of Record
Classification
USPC
174/52.4
H10W90/00
H10W90/732
H10W72/884
H10W90/756
H10W90/754
H10W90/734
Prosecution
- Examiner
- OLIVA, CARMELO B
- Art Unit
- 2831
- Docket No.
- M-9859 US
- Confirmation No.
- 5764
Patent Term Adjustment
-90days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2020-10-09
TERMINATION & RELEASE OF PATENT SECURITY AGREEMENT
Recorded 2006-01-03
SECURITY AGREEMENT
Recorded 2004-11-02
SECURITY AGREEMENT
Recorded 2004-07-06
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-04-06
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Quick Facts
- Patent No.
- US 6,603,072
- App. No.
- 09/828,046
- Filed
- 2001-04-06
- Granted
- 2003-08-05
- Examiner
- OLIVA, CARMELO B
- Art Unit
- 2831
- PTA
- -90 days
External Links