IP Library › Granted Patent US 6,597,059
Granted Patent Utility
US 6,597,059 · Confirmation No. 1318

THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE

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 Code Description Pages PDF
2012-12-20 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-12-20 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2012-11-30 PA.. Power of Attorney 1 View
2012-11-30 N417 Electronic Filing System Acknowledgment Receipt 2 View
2001-04-04 TRNA Transmittal of New Application 2 View
2001-04-04 SPEC Specification 11 View
2001-04-04 CLM Claims 5 View
2001-04-04 ABST Abstract 1 View
2001-04-04 DRW Drawings-only black and white line drawings 2 View
2001-04-04 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,597,059
App. No.
09/825,785
Filed
2001-04-04
Granted
2003-07-22
Art Unit
2811
PTA
-101 days