IP Library › Granted Patent US 6,650,019
Granted Patent Utility
US 6,650,019 · Confirmation No. 2714

METHOD OF MAKING A SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DIES

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 Code Description Pages PDF
2003-07-28 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-07-28 A... Amendment/Request for Reconsideration-After Non-Final Rejection 1 View
2003-07-28 SPEC Specification 1 View
2003-07-28 REM Applicant Arguments/Remarks Made in an Amendment 7 View
2002-08-20 TRNA Transmittal of New Application 2 View
2002-08-20 A.PE Preliminary Amendment 8 View
2002-08-20 SPEC Specification 19 View
2002-08-20 CLM Claims 7 View
2002-08-20 ABST Abstract 1 View
2002-08-20 DRW Drawings-only black and white line drawings 5 View
2002-08-20 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,650,019
App. No.
10/224,864
Filed
2002-08-20
Granted
2003-11-18
Pub. No.
US20020195624A1
Art Unit
2818
PTA
-114 days