IP Library Granted Patent US 6,534,391
Granted Patent Utility
US 6,534,391 · Confirmation No. 4291

SEMICONDUCTOR PACKAGE HAVING SUBSTRATE WITH LASER-FORMED APERTURE THROUGH SOLDER MASK LAYER

Patented Case View Patent ↗
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Code Description Pages PDF
2001-08-17 TRNA Transmittal of New Application 2 View
2001-08-17 SPEC Specification 11 View
2001-08-17 CLM Claims 4 View
2001-08-17 ABST Abstract 1 View
2001-08-17 DRW Drawings-only black and white line drawings 2 View
2001-08-17 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,534,391
App. No.
09/932,528
Filed
2001-08-17
Granted
2003-03-18
Examiner
DANG, PHUC T
Art Unit
2818
PTA
-153 days