IP Library Granted Patent US 6,528,869
Granted Patent Utility
US 6,528,869 · Confirmation No. 6968

SEMICONDUCTOR PACKAGE WITH MOLDED SUBSTRATE AND RECESSED INPUT/OUTPUT TERMINALS

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Code Description Pages PDF
2001-04-06 TRNA Transmittal of New Application 2 View
2001-04-06 OATH Oath or Declaration filed 1 View
2001-04-06 SPEC Specification 10 View
2001-04-06 CLM Claims 5 View
2001-04-06 ABST Abstract 1 View
2001-04-06 DRW Drawings-only black and white line drawings 4 View
2001-04-06 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,528,869
App. No.
09/827,619
Filed
2001-04-06
Granted
2003-03-04
Art Unit
2818
PTA
-95 days