Patent Assignment
Reel/Frame 011968/0256
Assignment of Assignor's Interest
Recorded: 2001-06-27
Received: 2001-07-17
Pages: 3
Assignors
LU, HONG-QIANG MICHAEL
Executed: 2001-06-25
ARTHANARI, SENTHIL K.
Executed: 2001-06-26
HU, JOHN RONGXIANG
Executed: 2001-06-26
ZHANG, KAI
Executed: 2001-06-26
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BOULEVARD, MILPITAS, CA, 95035, UNITED STATES
Covered Property
(1)
Process for Forming Integrated Circuit Structure with Low Dielectric Constant Material Between Closely Spaced Apart Metal Lines
Application:
09/892,250 →